Chip on film package with multilayer composite bumps bonded to multiple leads on a substrate

A chip-on-film package comprising:

• a substrate including a plurality of leads;
• and
• a chip including a body, a plurality of bond pads, a protective layer and a plurality of composite bumps, the plurality of bond pads are arranged on the body, a surface of the body is covered by the protective layer, the protective layer includes a plurality of openings, each of the plurality of openings is configured to expose one of the plurality of bond pads, each of the plurality of composite bumps includes a first raising strip, a under bump metallization (UBM) layer and a bonding layer, the first raising strip is located on the protective layer and covered by the UBM layer, the UBM layer of each of the plurality of composite bumps is electrically connected to one of the plurality of bond pads, covered by the bonding layer and includes a first rib located on the first raising strip, the bonding layer includes a first bonding rib located on the first rib along a first direction parallel to the surface of the body, the first bonding rib of the bonding layer of each of the plurality of composite bumps is configured to be inserted into one of the plurality of leads to allow each of the plurality of leads to include a first restricted rib located above each of the plurality of bond pads,
• wherein each of the plurality of composite bumps further includes a second raising strip which is located on the protective layer, the first raising strip is located between one of the plurality of openings of the protective layer and the second raising strip, the protective layer is exposed by a first gap which is located between the first and second raising strips, the second raising strip and the protective layer which is exposed by the first gap are covered by the UBM layer, the UBM layer further includes a second rib located on the second raising strip and a groove located between the first and second raising ribs and located between the first and second ribs, the bonding layer further includes a second bonding rib located on the second rib and a restriction groove located within the groove along the first direction, the restriction groove is located between the first and second bonding ribs, the second bonding rib on each of the plurality of composite bumps is configured to be inserted into one of the plurality of leads to allow each of the plurality of leads to include a second restricted rib located within the restriction groove, the second restricted rib is restricted between the first and second bonding ribs.