EMI cage for microstrip routing via dual layer underfill concept
AssigneeIntel Corporation
InventorsEng Huat Goh, Jiun Hann Sir, Chee Kheong Yoon, Telesphor Kamgaing, Min Suet Lim, Kavitha Nagarajan, Chu Aun Lim
Life of this patent
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Abstract
Embodiments disclosed herein include electronic packages. In an embodiment, an electronic package comprises a package substrate, and a die coupled to the package substrate. In an embodiment, a stiffener is around the die and over the package substrate. In an embodiment, an electrically non-conductive underfill is around first level interconnects (FLIs) between the package substrate and the die. In an embodiment, an electrically conductive layer is around the non-conductive underfill.
Claims22
An electronic package, comprising:
- a package substrate;
- a die coupled to the package substrate;
- a stiffener around the die and over the package substrate;
- an electrically non-conductive underfill around first level interconnects (FLIs) between the package substrate and the die;
- and
- an electrically conductive layer around the non-conductive underfill, wherein the non- conductive underfill is laterally intervening between the die and the electrically conductive layer such that the electrically conductive layer does not contact the die, and wherein the electrically conductive layer contacts the stiffener.
A method of forming an electronic package, comprising:
- providing a die and a stiffener over a package substrate;
- dispensing an underfill under the die around first level interconnects (FLIs);
- dispensing an electrically conductive layer around the underfill;
- and
- curing the electrically conductive layer, wherein the underfill is laterally intervening between the die and the electrically conductive layer such that the electrically conductive layer does not contact the die, and wherein the electrically conductive layer contacts the stiffener.
An electronic system, comprising:
- a board;
- a package substrate coupled to the board;
- a die coupled to the package substrate;
- an underfill around first level interconnects (FLIs) between the die and the package substrate;
- an electromagnetic interference (EMI) shield over the package substrate and around the underfill, wherein the underfill is laterally intervening between the die and the EMI shield such that the EMI shield does not contact the die;
- and
- a stiffener on the package substrate and around the die, wherein the EMI shield contacts the stiffener.
Dependencies are inferred from the claim text.