Methods and apparatus for package with interposers

A method of forming a device, comprising:

• forming a first metal layer above a first surface of a substrate;
• forming a first contact pad above the first metal layer;
• and
• forming a first dam above the first metal layer, wherein the first dam surrounds a first area around a first corner of the first metal layer, wherein the first dam rises above the first metal layer and has an upper surface higher than a top-most surface of the first area, and the first contact pad is within the first area.

A device, comprising:

• a substrate with a first surface and a second surface;
• a first metal layer above the first surface of the substrate;
• a first contact pad above the first metal layer;
• a first dam above the first metal layer, wherein the first dam surrounds a first area around a first corner of the first metal layer, and the first contact pad is within the first area;
• a non-conductive dam above the first dam;
• a connector above the first contact pad;
• a package connected to the connector, wherein the package comprises a substrate, and a die connected to the substrate;
• and
• an underfill under the package, above the first metal layer, covering the connector, and contained within the first area surrounded by the first dam.