Package-on-package semiconductor device
AssigneeTaiwan Semiconductor Manufacturing Company, Ltd.
InventorsChen-Hua Yu, Der-Chyang Yeh
Life of this patent
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Abstract
A semiconductor device and method of forming the semiconductor device, the semiconductor device includes a package having at least one first die and at least one second die. The semiconductor device further includes a set of conductive elements electrically connecting the at least one first and the at least one second die to a substrate. The semiconductor device further includes a thermal contact pad between the at least one first die and the at least one second die, to thermally isolate the at least one first die from the at least one second die.
Claims20
A semiconductor device comprising:
- a package having at least one first die and at least one second die;
- a set of conductive elements electrically connecting the at least one first die and the at least one second die to a substrate;
- a thermal contact pad between the at least one first die and the at least one second die, for thermally isolating the at least one first die from the at least one second die;
- and
- a molding compound over the substrate, wherein the molding compound is between a portion of thermal contact pad and at least one conductive element of the set of conductive elements.
A semiconductor device, comprising:
- a first package having at least one first die on a first substrate;
- a second package having at least one second die on a second substrate;
- a first set of conductive elements electrically connecting the first package with the second package;
- a thermal contact pad between the first package and the second package, for thermally isolating the first package from the second package, wherein the thermal contact pad has a thermal conductivity less than 0.5 Watts/Celsius;
- and
- a molding compound surrounding the thermal contact pad and interposed between portions of the thermal contact pad.
A semiconductor device comprising:
- a first die;
- a second die bonded to the first die, wherein the first die is electrically connected to the second die;
- a thermal contact pad between the first die and the second die, wherein the thermal contact pad is configured to thermally isolate the first die from the second die;
- and
- a seal ring between the first die and the second die, wherein the seal ring is located around an outer perimeter of the thermal contact pad.
Dependencies are inferred from the claim text.