H10W 72/387
Flow barriers
Official title: {Flow barriers}
H10W72/387 (Flow barriers) appears on 966 US grants and 1,202 published applications in this corpus.
Search patents in H10W- Granted patents
- 966
- Published applications
- 1,202
- Assignees
- 304
- Inventors
- 2,325
- Latest grant
- 29 Sep 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1985 | 1 | 0 |
| 1986 | 0 | 0 |
| 1987 | 0 | 0 |
| 1988 | 0 | 0 |
| 1989 | 1 | 0 |
| 1990 | 2 | 0 |
| 1991 | 3 | 0 |
| 1992 | 1 | 0 |
| 1993 | 0 | 0 |
| 1994 | 2 | 0 |
| 1995 | 3 | 0 |
| 1996 | 3 | 0 |
| 1997 | 3 | 0 |
| 1998 | 2 | 0 |
| 1999 | 2 | 0 |
| 2000 | 5 | 0 |
| 2001 | 4 | 4 |
| 2002 | 6 | 17 |
| 2003 | 9 | 12 |
| 2004 | 13 | 21 |
| 2005 | 11 | 27 |
| 2006 | 18 | 16 |
| 2007 | 17 | 22 |
| 2008 | 16 | 37 |
| 2009 | 7 | 28 |
| 2010 | 19 | 26 |
| 2011 | 25 | 40 |
| 2012 | 33 | 45 |
| 2013 | 53 | 54 |
| 2014 | 46 | 61 |
| 2015 | 46 | 55 |
| 2016 | 50 | 51 |
| 2017 | 57 | 59 |
| 2018 | 52 | 60 |
| 2019 | 62 | 81 |
| 2020 | 73 | 88 |
| 2021 | 63 | 88 |
| 2022 | 70 | 69 |
| 2023 | 61 | 59 |
| 2024 | 54 | 81 |
| 2025 | 42 | 59 |
| 2026 | 31 | 42 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Electronic devices and methods of manufacturing electronic devices29 Sep 2026US 12,751,321 B2Amkor Technology Singapore Holding Pte.Ltd.
- Semiconductor chip, semiconductor device, and semiconductor package including the same29 Sep 2026US 12,751,331 B2Samsung Electronics Co., Ltd.
- Packaged integrated circuit devices with enhanced dam structures that provide increased yield and reliability29 Sep 2026US 12,751,338 B2Samsung Electronics Co., Ltd.
- Electronic devices and methods of manufacturing electronic devices22 Sep 2026US 12,745,629 B2Amkor Technology Singapore Holding Pte.Ltd.
- Electronic package with improved heat dissipating and manufacturing method thereof22 Sep 2026US 12,745,630 B2Siliconware Precision Industries Co., Ltd.
- Lid Structure With Openings To Alleviate Leakage Of Thermal Interface Material Of A Chip Assembly8 Oct 2026US 2026/0314397 A1Taiwan Semiconductor Manufacturing Company.Ltd
- Thermal interface material bleed control for heat spreaders1 Oct 2026US 2026/0305388 A1Intel Corporation
- Underfill adhesive flow control using dam structure24 Sep 2026US 2026/0293738 A1QUALCOMM Incorporated
- Micro-electro-mechanical system package17 Sep 2026US 2026/0274649 A1Vanguard International Semiconductor Corporation
- Methods for deposition of a thermal interface material and circuit assemblies formed therefrom10 Sep 2026US 2026/0271766 A1Arieca Inc.
Most cited
By later US patents
- Sensor mounted in flip-chip technology on a substrate274US 8,791,532 B2Sensirion AG · 2014
- Self-centering electrode for power devices249US 4,935,803 AMotorola, Inc. · 1990
- Symmetrical package for semiconductor die208US 6,256,200 B12001
- Ball grid array integrated circuit package with thermal conductor198US 5,583,378 AAmkor Electronics, Inc. · 1996
- Surface mount semiconductor package, die-leadframe combination and leadframe therefor and method of mounting leadframes to surfaces of semiconductor die149US 6,307,755 B12001