Sensor mounted in flip-chip technology on a substrate

A sensor assembly comprising:

• a substrate,
• a sensor chip flip-chip mounted to said substrate with a first side of said sensor chip facing said substrate,
• a sensing area integrated on the first side of said sensor chip, wherein said sensing area is structured to measure at least one parameter,
• contact pads integrated on the first side of said sensor chip in a contact section of said sensor chip, wherein said contact pads are electrically connected to said substrate,
• a dam extending between said sensor chip and said substrate, wherein a chamber is formed between said sensor chip, said substrate, and said dam, with said sensing area being located at least partially in said chamber and with said dam being arranged between said contact section and said chamber, and
• at least one opening extending from said chamber to an environment around said sensor assembly, wherein said opening is arranged between said substrate and said sensor chip and extends from at least a first edge of said sensor chip to said chamber, wherein said dam extends to said first edge, and wherein said opening extends from said first edge and a second edge of said sensor chip to said chamber and wherein said dam extends to said first edge and said second edge, wherein said first edge is adjacent to said second edge.

A sensor assembly comprising:

• a substrate,
• a sensor chip flip-chip mounted to said substrate with a first side of said sensor chip facing said substrate,
• a sensing area integrated on the first side of said sensor chip, wherein said sensing area is structured to measure at least one parameter,
• contact pads integrated on the first side of said sensor chip in a contact section of said sensor chip, wherein said contact pads are electrically connected to said substrate,
• a dam extending between said sensor chip and said substrate, wherein a chamber is formed between said sensor chip, said substrate, and said dam, with said sensing area being located at least partially in said chamber and with said dam being arranged between said contact section and said chamber, and
• at least one opening extending from said chamber to an environment around said sensor assembly, wherein said opening is arranged between said substrate and said sensor chip and extends from at least a first edge of said sensor chip to said chamber, wherein said dam extends to said first edge, and wherein said dam comprises a base extending from a second edge to a fourth edge of said sensor chip, a first leg extending from said base along said fourth edge of said sensor chip to said first edge of said sensor chip, and a second leg extending from said base along said second edge of said sensor chip to said first edge of said sensor chip, and wherein said opening is formed between said first and second legs.

A sensor assembly comprising:

• a substrate,
• a sensor chip flip-chip mounted to said substrate with a first side of said sensor chip facing said substrate,
• a sensing area integrated on the first side of said sensor chip, wherein said sensing area is structured to measure at least one parameter,
• contact pads integrated on the first side of said sensor chip in a contact section of said sensor chip, wherein said contact pads are electrically connected to said substrate,
• a dam extending between said sensor chip and said substrate, wherein a chamber is formed between said sensor chip, said substrate, and said dam, with said sensing area being located at least partially in said chamber and with said dam being arranged between said contact section and said chamber,
• at least one opening extending from said chamber to an environment around said sensor assembly, wherein said opening extends through said sensor chip, and
• an underfill arranged in said contact section between said sensor chip and said substrate, wherein said dam is arranged between said underfill and said sensing area, and wherein said dam extends sealingly around said chamber.

A sensor assembly comprising:

• a substrate,
• a sensor chip flip-chip mounted to said substrate with a first side of said sensor chip facing said substrate,
• a sensing area integrated on the first side of said sensor chip, wherein said sensing area is structured to measure at least one parameter,
• contact pads integrated on the first side of said sensor chip in a contact section of said sensor chip, wherein said contact pads are electrically connected to said substrate,
• a dam extending between said sensor chip and said substrate, wherein a chamber is formed between said sensor chip, said substrate, and said dam, with said sensing area being located at least partially in said chamber and with said dam being arranged between said contact section and said chamber, and
• at least one opening extending from said chamber to an environment around said sensor assembly, wherein said opening is arranged between said substrate and said sensor chip or extends through said sensor chip, and wherein said dam comprises one or more recesses or gaps extending in a single layer of said dam.