Micro-electro-mechanical system package

Abstract

A MEMS package includes a first substrate, an interconnect layer, a MEMS device layer, a stand-off structure, a bonding material layer and a second substrate. The interconnect layer is disposed on the first substrate. The MEMS device layer includes a MEMS device and is disposed above the interconnect layer. The stand-off structure is disposed under the MEMS device layer, around the MEMS device and bonded to the interconnect layer. The stand-off structure includes an inner sidewall, an outer sidewall and a bottom surface. The bonding material layer is applied on the outer sidewall and a portion of the bottom surface of the stand-off structure. In addition, the second substrate includes a cavity and is bonded to the MEMS device layer.

Dependencies are inferred from the claim text.