Methods for deposition of a thermal interface material and circuit assemblies formed therefrom

Abstract

Methods of deposition of a thermal interface material and integrated circuit assemblies formed therefrom are provided. The method comprising depositing a constraint proximal to a first layer of a circuit assembly. The method comprises depositing a thermal interface material at a first layer thickness between a first layer of a circuit assembly and a second layer of the circuit assembly. The thermal interface material comprises an emulsion of liquid metal droplets and polymer. The method comprises compressing the circuit assembly to decrease the first layer thickness to a second layer thickness, thereby deforming the liquid metal droplets. Spread of the thermal interface material across a surface of the first layer is limited by the constraint.

Dependencies are inferred from the claim text.