Self-centering electrode for power devices

An electronic device comprising:

• an electronic chip having a first surface for attachment to a lead means and a second surface with a bonding pad thereon for receiving a connection means;
• lead means having a first portion for receiving the electronic chip and a second portion including a first alignment means for alignment of the connection means;
• and
• connection means for connecting the lead means to the electronic chip, having a first portion for coupling to the bonding pad and a second portion with a second alignment means which mates with the first alignment means for aligning the connection means between the lead means and the bonding pad, wherein the first alignment means comprises a first depression and the second alignment means comprises a first protrusion mating with the first depression.

A semiconductor device, comprising:

• a support member having a die bonding region;
• a lead member comprising a first alignment means for aligning a separate connection means;
• a semiconductor die mounted on the die bonding region wherein the semiconductor die has thereon a bonding pad for receiving part of the connection means;
• connection means having a second alignment means and a connection region located proximate to the bonding pad;
• and
• first solder means for coupling the bonding pad and the connection region and second solder means for coupling the mating alignment means wherein the mating alignment means facilitate, while the solder means are liquid, some rotation of the connection means in a direction perpendicular to the die but not in a direction parallel to the die.