H10W 72/341
Dispositions of die-attach connectors
Official title: {Dispositions of die-attach connectors, e.g. layouts}
H10W72/341 (Dispositions of die-attach connectors) appears on 2,818 US grants and 3,691 published applications in this corpus.
Search patents in H10W- Granted patents
- 2,818
- Published applications
- 3,691
- Assignees
- 618
- Inventors
- 5,574
- Latest grant
- 6 Oct 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1978 | 1 | 0 |
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| 1983 | 0 | 0 |
| 1984 | 1 | 0 |
| 1985 | 0 | 0 |
| 1986 | 1 | 0 |
| 1987 | 1 | 0 |
| 1988 | 0 | 0 |
| 1989 | 0 | 0 |
| 1990 | 1 | 0 |
| 1991 | 1 | 0 |
| 1992 | 0 | 0 |
| 1993 | 1 | 0 |
| 1994 | 1 | 0 |
| 1995 | 2 | 0 |
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| 1997 | 2 | 0 |
| 1998 | 1 | 0 |
| 1999 | 5 | 0 |
| 2000 | 5 | 0 |
| 2001 | 5 | 4 |
| 2002 | 3 | 17 |
| 2003 | 8 | 10 |
| 2004 | 7 | 16 |
| 2005 | 13 | 24 |
| 2006 | 19 | 17 |
| 2007 | 15 | 19 |
| 2008 | 13 | 34 |
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| 2011 | 28 | 50 |
| 2012 | 22 | 116 |
| 2013 | 75 | 104 |
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| 2015 | 129 | 208 |
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| 2019 | 198 | 267 |
| 2020 | 235 | 380 |
| 2021 | 237 | 348 |
| 2022 | 277 | 349 |
| 2023 | 240 | 231 |
| 2024 | 246 | 326 |
| 2025 | 212 | 267 |
| 2026 | 132 | 111 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Subgroups
Granted patents
Recent patents
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- Wiring board, semiconductor device, and method for manufacturing semiconductor device6 Oct 2026US 12,757,762 B2Kioxia Corporation
- Chiplet-fine-interconnection-package structure and method of manufacturing the same6 Oct 2026US 12,757,767 B2Institute of Semiconductors, Guangdong Academy of Sciences
- Package structure with protective lid6 Oct 2026US 12,757,797 B2Taiwan Semiconductor Manufacturing Company.Ltd
- Multiple plated via arrays of different wire heights on a same substrate6 Oct 2026US RE51,062 E1Adeia Semiconductor Technologies LLC
- Lid Structure With Openings To Alleviate Leakage Of Thermal Interface Material Of A Chip Assembly8 Oct 2026US 2026/0314397 A1Taiwan Semiconductor Manufacturing Company.Ltd
- Semiconductor Device and Method of Making a Semiconductor Package with Graphene for Die Attach1 Oct 2026US 2026/0305028 A1STATS ChipPAC Pte. Ltd.
- Package structure and manufacturing method thereof1 Oct 2026US 2026/0305362 A1Taiwan Semiconductor Manufacturing Company.Ltd
- Pixel device for led display and led display apparatus having the same1 Oct 2026US 2026/0305469 A1Seoul Viosys Co., Ltd.
- Circuit device with embedded heat sink24 Sep 2026US 2026/0293668 A1
Most cited
By later US patents
- Solder interconnection structure for joining semiconductor devices to substrates that have improved fatigue life, and process for making339US 4,604,644 AInternational Business Machines Corporation · 1986
- Methods for surface attachment of flipped active componenets316US 8,889,485 B2Semprius, Inc. · 2014
- Three dimensional device integration method and integrated device220US 7,126,212 B2Ziptronix, Inc. · 2006
- Three-dimensional (3D) integrated circuit with enhanced copper-to-copper bonding214US 8,546,956 B2International Business Machines Corporation · 2013
- Mold-type semiconductor device207US 5,218,231 AKabushiki Kaisha Toshiba · 1993