Package structure and manufacturing method thereof
AssigneeTaiwan Semiconductor Manufacturing Company, Ltd.
InventorsChung-Hao Tsai, Tzu-Chun Tang, Chuei-Tang WANG, Chen-Hua Yu
Life of this patent
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Abstract
A package structure includes a first package component including an integrated circuit (IC) die, a substrate, a redistribution structure, and an antenna structure electrically coupled to the IC die through the redistribution structure. The substrate includes a semiconductor material and wider than the IC die, and the redistribution structure is disposed over a first side of the substrate and electrically coupled to the IC die. The package structure further includes an underfill interfaced with a second side of the substrate opposite to the first side, and the underfill covers a sidewall of the first package component.
Claims20
A device, comprising:
- a first package component comprising:
- an integrated circuit (IC) die;
- a substrate comprising a semiconductor material and wider than the IC die;
- a redistribution structure disposed over a first side of the substrate and electrically coupled to the IC die;
- an antenna structure electrically coupled to the IC die through the redistribution structure;
- and
- an underfill interfaced with a second side of the substrate opposite to the first side, the underfill covering a sidewall of the first package component.
A device, comprising:
- a first package component comprising:
- an IC die;
- a substrate coupled to the IC die through a first thermally conductive layer;
- an antenna structure electrically coupled to the IC die;
- a second package component electrically coupled to the first package component;
- and
- an underfill disposed between the first package component and the second package component and extending along a sidewall of the first package component.
A device, comprising:
- a first package component comprising an encapsulated die structure, a redistribution structure, and an antenna structure which are sequentially stacked, the encapsulated die structure comprising:
- an IC die;
- and
- a semiconductor substrate wider than the IC die and coupled to the IC die through a thermally conductive layer;
- and
- an underfill coupled to the semiconductor substrate and extending beyond a sidewall of the first package component.
Dependencies are inferred from the claim text.