Chiplet-fine-interconnection-package structure and method of manufacturing the same

A method of manufacturing a chiplet-fine-interconnection-package structure, comprising:

• mounting at least two chips on a first side surface of a substrate, wherein each chip includes a first pin-array having a first spacing and a second pin-array having a second spacing;
• bonding a silicon bridge structure for electrically connecting the two adjacent chips on the first pin-arrays of the two adjacent chips;
• preparing a temporary bonding layer on the silicon bridge structure;
• preparing a plastic package layer on a second side surface of the substrate, wherein the substrate is prepared with microvias to allow plastic package materials of the plastic package layer to flow from the microvias into an area between the first side surface of the substrate and the temporary bonding layer to prepare the plastic package layer which covers the substrate, the chips and the silicon bridge structure without covering a first silicon bridge surface of the silicon bridge structure;
• releasing the temporary bonding layer;
• and
• preparing on the plastic package layer a solder bump electrically connected with the second pin-array through the plastic package layer, or preparing a build-up layer on the plastic package layer and preparing the solder bump electrically connected with the second pin-array through the plastic package layer and the build-up layer on the build-up layer.