H10W 72/344
Relative to underlying supporting features
Official title: {relative to underlying supporting features, e.g. bond pads, RDLs or vias}
H10W72/344 (Relative to underlying supporting features) appears on 630 US grants and 786 published applications in this corpus.
Search patents in H10W- Granted patents
- 630
- Published applications
- 786
- Assignees
- 240
- Inventors
- 1,559
- Latest grant
- 6 Oct 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1984 | 1 | 0 |
| 1985 | 0 | 0 |
| 1986 | 1 | 0 |
| 1987 | 0 | 0 |
| 1988 | 0 | 0 |
| 1989 | 0 | 0 |
| 1990 | 0 | 0 |
| 1991 | 1 | 0 |
| 1992 | 0 | 0 |
| 1993 | 0 | 0 |
| 1994 | 0 | 0 |
| 1995 | 1 | 0 |
| 1996 | 0 | 0 |
| 1997 | 2 | 0 |
| 1998 | 0 | 0 |
| 1999 | 3 | 0 |
| 2000 | 1 | 0 |
| 2001 | 3 | 1 |
| 2002 | 1 | 6 |
| 2003 | 2 | 3 |
| 2004 | 3 | 1 |
| 2005 | 3 | 6 |
| 2006 | 4 | 3 |
| 2007 | 2 | 3 |
| 2008 | 5 | 13 |
| 2009 | 4 | 9 |
| 2010 | 6 | 8 |
| 2011 | 14 | 13 |
| 2012 | 6 | 40 |
| 2013 | 17 | 31 |
| 2014 | 33 | 27 |
| 2015 | 43 | 58 |
| 2016 | 49 | 53 |
| 2017 | 47 | 49 |
| 2018 | 41 | 46 |
| 2019 | 44 | 45 |
| 2020 | 50 | 70 |
| 2021 | 37 | 65 |
| 2022 | 53 | 75 |
| 2023 | 45 | 36 |
| 2024 | 54 | 60 |
| 2025 | 33 | 56 |
| 2026 | 21 | 9 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Packaging structure having organic interposer layer and method for manufacturing same6 Oct 2026US 12,757,749 B2SJ Semiconductor(Jiangyin) Corporation
- Chiplet-fine-interconnection-package structure and method of manufacturing the same6 Oct 2026US 12,757,767 B2Institute of Semiconductors, Guangdong Academy of Sciences
- Display device29 Sep 2026US 12,751,160 B2Samsung Display Co., Ltd.
- Diode layer stack flip-chip mounted to a leadframe by use of a copper nickel tin metallization stack and diffusion soldering15 Sep 2026US 12,740,438 B2Infineon Technologies Austria AG
- Power semiconductor device and manufacturing method8 Sep 2026US 12,733,493 B2Hitachi Energy Ltd
- Package structure and manufacturing method thereof1 Oct 2026US 2026/0305362 A1Taiwan Semiconductor Manufacturing Company.Ltd
- Micro-electro-mechanical system package17 Sep 2026US 2026/0274649 A1Vanguard International Semiconductor Corporation
- Display device and method of manufacturing the same16 Jul 2026US 2026/0206318 A1Samsung Display Co., Ltd.
- Module and apparatus18 Jun 2026US 2026/0173565 A1Canon Kabushiki Kaisha
- Package structures11 Jun 2026US 2026/0165127 A1Taiwan Semiconductor Manufacturing Company.Ltd
Most cited
By later US patents
- Solder interconnection structure for joining semiconductor devices to substrates that have improved fatigue life, and process for making339US 4,604,644 AInternational Business Machines Corporation · 1986
- Methods for surface attachment of flipped active componenets316US 8,889,485 B2Semprius, Inc. · 2014
- Three dimensional device integration method and integrated device220US 7,126,212 B2Ziptronix, Inc. · 2006
- Three dimensional device integration method and integrated device194US 9,431,368 B2Ziptronix, Inc. · 2016
- Method of assembling stacks of integrated circuit dies179US 4,984,358 AMicroelectronics and Computer Technology Corporation · 1991