Module and apparatus

A module comprising:

• a wiring board having a mounting surface;
• a first semiconductor element and a second semiconductor element that are electrically connected to the wiring board, overlap the wiring board in a first direction perpendicular to the mounting surface, and are arranged side by side in a second direction along the mounting surface;
• and
• an adhesive that bonds, on the mounting surface, to the wiring board, the first semiconductor element, and the second semiconductor element,
• wherein the adhesive includes a first portion located between the wiring board and the first semiconductor element in the first direction, a second portion located between the wiring board and the second semiconductor element in the first direction, and a third portion located between the first semiconductor element and the second semiconductor element in the second direction,
• wherein a width Dc of the third portion in the second direction, which is defined by the first semiconductor element and the second semiconductor element, is smaller than a sum of a thickness Ta of the first portion in the first direction and a thickness Tb of the second portion in the first direction, and
• wherein a distance Da from at least part of a first contour of a projection of the first semiconductor element onto the mounting surface in the first direction to at least part of an outer edge of a board bonding surface, which is a bonding surface of the adhesive bonded to the wiring board, is smaller than the width Dc.