Packaging structure having organic interposer layer and method for manufacturing same

A method for manufacturing a packaging structure having an organic interposer layer, comprising:

• forming a rewiring layer over a semiconductor substrate, wherein the rewiring layer comprises metal wiring layers and inorganic dielectric layers, wherein each of the inorganic dielectric layers is placed on top of one of the metal wiring layers, wherein the metal wiring layers and the inorganic dielectric layers are formed in an alternating sequence on a surface of the semiconductor substrate;
• forming conductive pillars over the rewiring layer, wherein the conductive pillars are electrically connected to the rewiring layer;
• forming an organic dielectric layer over the rewiring layer, with the organic dielectric layer covering the rewiring layer and the conductive pillars, and thinning the organic dielectric layer and the conductive pillars, wherein the thinned organic dielectric layer and the thinned conductive pillar are flush with each other;
• forming solder bumps over the thinned organic dielectric layer and the thinned conductive pillars, with the solder bumps electrically connected to the conductive pillars;
• bonding a support substrate to the solder bumps through an adhesive layer;
• removing the semiconductor substrate to expose surfaces of the metal wiring layers facing away from the organic dielectric layer, and forming bonding pads on the exposed surfaces of the metal wiring layers, with the bonding pads being electrically connected to the metal wiring layers;
• connecting a cutting carrier to the bonding pads, and disengaging the support substrate by removing the adhesive layer to obtain an intermediate structure, wherein the cutting carrier is fixed to a frame;
• cutting the intermediate structure to obtain multiple pre-encapsulation structures after disengaging the support substrate;
• removing the cutting carrier from the bonding pads in the intermediate structure;
• and
• bonding functional chips to the bonding pads in the intermediate structure, wherein the functional chips are then electrically connected to the bonding pads.