Wiring board, semiconductor device, and method for manufacturing semiconductor device
AssigneeKioxia Corporation
InventorKeiichi Niwa
Life of this patent
Estimating the term…
Abstract
According to one embodiment, a wiring board, includes a conductive layer on a first surface and an insulating layer covering a portion of the conductive layer. The conductive layer includes a first connection portion exposed from the insulating layer and having a first wettability to solder, a lead-out portion connected to the first connection portion and exposed from the insulating layer and having a second wettability to solder, and a wiring portion connected to the first connection portion via the lead-out portion and covered with the insulating layer. In some examples, the first connection portion may be coated with a gold layer and the conductive layer may be copper or a copper alloy material.
Claims15
A wiring board, comprising:
- a conductive layer on a first surface;
- and
- an insulating layer covering a portion of the conductive layer, wherein
- the conductive layer includes:
- a first connection portion exposed from the insulating layer and having a first wettability to solder;
- a lead-out portion connected to the first connection portion and exposed from the insulating layer and having a second wettability to solder, the second wettability being different from the first wettability;
- and
- a wiring portion connected to the first connection portion via the lead-out portion and covered with the insulating layer, and
- a tip end of the first connection portion has a side surface with the first wettability.
A semiconductor device, comprising:
- a wiring board with a conductive layer on a first surface and an insulating layer covering a portion of the conductive layer, the conductive layer including:
- a first connection portion exposed from the insulating layer and having a first wettability to solder;
- a lead-out portion connected to the first connection portion and exposed from the insulating layer and having a second wettability to solder, the second wettability being different from the first wettability;
- and
- a wiring portion connected to the first connection portion via the lead-out portion and covered with the insulating layer;
- and
- a first semiconductor element with a first electrode soldered to the first connection portion, wherein
- a tip end of the first connection portion has a side surface with the first wettability.
Dependencies are inferred from the claim text.