H10W 72/345
Of outermost layers of multilayered die-attach connectors
Official title: {of outermost layers of multilayered die-attach connectors, e.g. coating being only on a part of a core}
H10W72/345 (Of outermost layers of multilayered die-attach connectors) appears on 42 US grants and 57 published applications in this corpus.
Search patents in H10W- Granted patents
- 42
- Published applications
- 57
- Assignees
- 32
- Inventors
- 96
- Latest grant
- 11 Aug 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 2000 | 1 | 0 |
| 2001 | 1 | 0 |
| 2002 | 0 | 1 |
| 2003 | 2 | 1 |
| 2004 | 1 | 0 |
| 2005 | 0 | 1 |
| 2006 | 0 | 1 |
| 2007 | 0 | 0 |
| 2008 | 1 | 0 |
| 2009 | 0 | 0 |
| 2010 | 0 | 1 |
| 2011 | 0 | 0 |
| 2012 | 0 | 3 |
| 2013 | 3 | 3 |
| 2014 | 1 | 6 |
| 2015 | 2 | 4 |
| 2016 | 6 | 2 |
| 2017 | 3 | 7 |
| 2018 | 3 | 1 |
| 2019 | 3 | 3 |
| 2020 | 1 | 0 |
| 2021 | 2 | 2 |
| 2022 | 1 | 8 |
| 2023 | 0 | 5 |
| 2024 | 5 | 4 |
| 2025 | 4 | 3 |
| 2026 | 2 | 1 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
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- Multi-layer sheet for mold underfill encapsulation, method for mold underfill encapsulation, electronic component mounting substrate, and production method for electronic component15 Jul 2025US 12,362,310 B2Nagase Chemtex Corporation
- Flip chip light emitting diode (led) interconnect15 Jan 2026US 2026/0018553 A1Dominant Opto Technologies Sdn Bhd.
- Semiconductor package device having fan-out structure and method of manufacturing the same18 Dec 2025US 2025/0385221 A1Silicon Box Pte. Ltd.
- Semiconductor packages with an intermetallic layer19 Jun 2025US 2025/0201753 A1Semiconductor Components Industries, LLC
- Semiconductor packages with an intermetallic layer5 Jun 2025US 2025/0183217 A1Semiconductor Components Industries, LLC
- Sensor device and method for manufacturing sensor device21 Nov 2024US 2024/0387437 A1Mitsumi Electric Co., Ltd.
Most cited
By later US patents
- Three-dimensional (3D) integrated circuit with enhanced copper-to-copper bonding214US 8,546,956 B2International Business Machines Corporation · 2013
- Semiconductor flip-chip assembly with pre-applied encapsulating layers169US 6,297,560 B12001
- Semiconductor flip-chip package and method for the fabrication thereof141US 6,121,689 AMiguel Albert Capote · 2000
- Semiconductor flip-chip package and method for the fabrication thereof101US 6,518,677 B12003
- Semiconductor flip-chip package and method for the fabrication thereof37US 6,774,493 B2M. A. Capote · 2004