Semiconductor package device having fan-out structure and method of manufacturing the same
AssigneeSilicon Box Pte. Ltd.
InventorsByung Joon HAN, Young Michael HAN, Byung Hoon AHN
Life of this patent
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Abstract
Disclosed is a method of manufacturing a semiconductor package device having a fan-out structure, the method including providing a unit device structure including a semiconductor chip having a plurality of bumps disposed on one surface thereof and a non-conductive cover layer disposed to cover the one surface and at least a part of a side surface of the semiconductor chip so as to fill a space between and around the plurality of bumps, the non-conductive cover layer being configured to expose the plurality of bumps, and manufacturing a semiconductor package device having a fan-out structure using the unit device structure.
Claims17
A method of manufacturing a semiconductor package device having a fan-out structure, the method comprising:
- providing a unit device structure comprising a semiconductor chip having a plurality of bumps disposed on one surface thereof and a non-conductive cover layer disposed to cover the one surface and at least a part of a side surface of the semiconductor chip so as to fill a space between and around the plurality of bumps, the non-conductive cover layer being configured to expose the plurality of bumps;
- and
- manufacturing a semiconductor package device having a fan-out structure using the unit device structure, the semiconductor package device comprising the unit device structure, a molding layer configured to form a single substrate layer together with the unit device structure while filling a space around the unit device structure, the molding layer being configured to expose one surface of the unit device structure such that the plurality of bumps is exposed, a redistribution layer member disposed on one surface of the substrate layer comprising the unit device structure and the molding layer so as to be electrically connected to the plurality of bumps, and a plurality of electrical connection elements disposed on one surface of the redistribution layer member so as electrically connected to the semiconductor chip via the redistribution layer member on a side opposite a side on which the substrate layer is disposed.
A semiconductor package device having a fan-out structure, the semiconductor package device comprising:
- a unit device structure comprising a semiconductor chip having a plurality of bumps disposed on one surface thereof and a non-conductive cover layer disposed to cover the one surface and at least a part of a side surface of the semiconductor chip so as to fill a space between and around the plurality of bumps, the non-conductive cover layer being configured to expose the plurality of bumps;
- a molding layer configured to form a single substrate layer together with the unit device structure while filling a space around the unit device structure, the molding layer being configured to expose one surface of the unit device structure such that the plurality of bumps is exposed;
- a redistribution layer member disposed on one surface of the substrate layer comprising the unit device structure and the molding layer so as to be electrically connected to the plurality of bumps;
- and
- a plurality of electrical connection elements disposed on one surface of the redistribution layer member so as to be electrically connected to the semiconductor chip via the redistribution layer member on a side opposite a side on which the substrate layer is disposed.
Dependencies are inferred from the claim text.