Sensor device and method for manufacturing sensor device
AssigneeMitsumi Electric Co., Ltd.
InventorsSoichiro SUZU, Satoshi KURIBAYASHI
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Abstract
A sensor device includes a semiconductor sensor element and a substrate on which the semiconductor sensor element is mounted. The substrate includes a sensor-element mounted portion at which the semiconductor sensor element is mounted, and includes a first resist portion that surrounds the sensor-element mounted portion. The substrate includes a first region adjacent to the first resist portion and being covered with a resin layer, and includes a second resist portion that surrounds the first resist portion, the first region being interposed between the first resist portion and the second resist portion. The substrate includes at least one third resist portion extending from the first resist portion toward the second resist portion.
Claims6
A sensor device comprising:
- a semiconductor sensor element;
- and
- a substrate on which the semiconductor sensor element is mounted, the substrate including
- a sensor-element mounted portion at which the semiconductor sensor element is mounted,
- a first resist portion that surrounds the sensor-element mounted portion,
- a first region adjacent to the first resist portion, and being covered with a resin layer,
- a second resist portion that surrounds the first resist portion, the first region being interposed between the first resist portion and the second resist portion, and
- at least one third resist portion extending from the first resist portion toward the second resist portion.
A method for manufacturing a sensor device by mounting a semiconductor sensor element at a sensor-element mounted portion in a substrate, the method comprising:
- forming a first resist portion to surround the sensor-element mounted portion;
- forming a second resist portion to surround the first resist portion such that a first region is interposed between the first resist portion and the second resist portion;
- forming at least one third resist portion that extends from the first resist portion toward the second resist portion;
- disposing a resin infusion unit above the third resist portion and infusing a resin from the resin infusion unit;
- and
- forming a resin layer that covers the first region as a result of infusing the resin.
Dependencies are inferred from the claim text.