Metal jointed body, semiconductor device, wave guide tube, and method for joining members to be joined
AssigneeMitsubishi Electric Corporation
InventorsTakashi Ijima, Koji Yamazaki
Life of this patent
Estimating the term…
Loading patent…
AssigneeMitsubishi Electric Corporation
InventorsTakashi Ijima, Koji Yamazaki
Estimating the term…
Provided is a metal jointed body, joined by solid-phase joining in the atmosphere, in which no protrusion of molten joining material occurs, that improves dimensional stability. A metal jointed body is formed by (A) making Ag films of two metal laminated bodies opposed to each other, the metal jointed body being configured by sequentially laminating a Zn film and an Ag film on an Al substrate serving as a member to be joined, and (B) bringing the Ag films into contact with each other, then (C) heating is performed while pressurizing, and closely adhering and solid-phase joining the Ag films to each other. The completed metal jointed body is a portion where Al—Ag alloy layers are provided on both sides of an Ag—Zn—Al alloy layer to join the Al substrates to each other.
A metal jointed body comprising:
A wave guide tube with a tubular shape having a cavity therein, wherein
A method for joining members to be joined in which a laminated body is used, the laminated body is such that a Zn layer is joined and laminated on an Al layer which is an Al substrate serving as a member to be joined or an Al film formed on a member to be joined, and an Ag layer is joined and laminated on a surface opposite to a surface of the Zn layer joined on the Al layer, the method comprising the steps of:
Dependencies are inferred from the claim text.