H10W 72/347
Dispositions of multiple die-attach connectors
Official title: {Dispositions of multiple die-attach connectors}
H10W72/347 (Dispositions of multiple die-attach connectors) appears on 2,154 US grants and 2,800 published applications in this corpus.
Search patents in H10W- Granted patents
- 2,154
- Published applications
- 2,800
- Assignees
- 478
- Inventors
- 4,161
- Latest grant
- 6 Oct 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1978 | 1 | 0 |
| 1979 | 0 | 0 |
| 1980 | 0 | 0 |
| 1981 | 1 | 0 |
| 1982 | 0 | 0 |
| 1983 | 0 | 0 |
| 1984 | 0 | 0 |
| 1985 | 0 | 0 |
| 1986 | 0 | 0 |
| 1987 | 1 | 0 |
| 1988 | 0 | 0 |
| 1989 | 0 | 0 |
| 1990 | 1 | 0 |
| 1991 | 0 | 0 |
| 1992 | 0 | 0 |
| 1993 | 1 | 0 |
| 1994 | 1 | 0 |
| 1995 | 1 | 0 |
| 1996 | 0 | 0 |
| 1997 | 0 | 0 |
| 1998 | 1 | 0 |
| 1999 | 2 | 0 |
| 2000 | 3 | 0 |
| 2001 | 1 | 3 |
| 2002 | 2 | 15 |
| 2003 | 5 | 7 |
| 2004 | 5 | 12 |
| 2005 | 11 | 16 |
| 2006 | 17 | 15 |
| 2007 | 10 | 14 |
| 2008 | 9 | 25 |
| 2009 | 10 | 16 |
| 2010 | 17 | 18 |
| 2011 | 14 | 36 |
| 2012 | 16 | 78 |
| 2013 | 53 | 66 |
| 2014 | 72 | 96 |
| 2015 | 89 | 148 |
| 2016 | 122 | 168 |
| 2017 | 141 | 134 |
| 2018 | 133 | 160 |
| 2019 | 157 | 222 |
| 2020 | 194 | 309 |
| 2021 | 198 | 280 |
| 2022 | 216 | 259 |
| 2023 | 188 | 178 |
| 2024 | 190 | 259 |
| 2025 | 177 | 182 |
| 2026 | 94 | 84 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Subgroups
Granted patents
Recent patents
- Wiring board, semiconductor device, and method for manufacturing semiconductor device6 Oct 2026US 12,757,762 B2Kioxia Corporation
- Package structure with protective lid6 Oct 2026US 12,757,797 B2Taiwan Semiconductor Manufacturing Company.Ltd
- Multiple plated via arrays of different wire heights on a same substrate6 Oct 2026US RE51,062 E1Adeia Semiconductor Technologies LLC
- Systems and methods for active discharge for inverter for electric vehicle22 Sep 2026US 12,745,369 B2BorgWarner US Technologies LLC
- Electronic devices and methods of manufacturing electronic devices22 Sep 2026US 12,745,629 B2Amkor Technology Singapore Holding Pte.Ltd.
- Lid Structure With Openings To Alleviate Leakage Of Thermal Interface Material Of A Chip Assembly8 Oct 2026US 2026/0314397 A1Taiwan Semiconductor Manufacturing Company.Ltd
- Semiconductor Device and Method of Making a Semiconductor Package with Graphene for Die Attach1 Oct 2026US 2026/0305028 A1STATS ChipPAC Pte. Ltd.
- Pixel device for led display and led display apparatus having the same1 Oct 2026US 2026/0305469 A1Seoul Viosys Co., Ltd.
- Electronic package and shielding part including semiconductor block and magnetized layer24 Sep 2026US 2026/0293688 A1Siliconware Precision Industries Co., Ltd.
- Semiconductor device24 Sep 2026US 2026/0293727 A1Denso Corporation
Most cited
By later US patents
- Three dimensional device integration method and integrated device220US 7,126,212 B2Ziptronix, Inc. · 2006
- Mold-type semiconductor device207US 5,218,231 AKabushiki Kaisha Toshiba · 1993
- Three dimensional device integration method and integrated device194US 9,431,368 B2Ziptronix, Inc. · 2016
- Magnetic shielding of MRAM package190US 9,875,971 B2Globalfoundries Singapore Pte. Ltd. · 2018
- DBI to Si bonding for simplified handle wafer174US 10,964,664 B2Invensas Bonding Technologies, Inc. · 2021