H10W 72/342
Relative to the surface
Official title: {relative to the surface, e.g. recessed, protruding}
H10W72/342 (Relative to the surface) appears on 210 US grants and 324 published applications in this corpus.
Search patents in H10W- Granted patents
- 210
- Published applications
- 324
- Assignees
- 144
- Inventors
- 742
- Latest grant
- 6 Oct 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 2004 | 0 | 3 |
| 2005 | 1 | 3 |
| 2006 | 2 | 2 |
| 2007 | 4 | 2 |
| 2008 | 1 | 0 |
| 2009 | 0 | 0 |
| 2010 | 0 | 3 |
| 2011 | 0 | 5 |
| 2012 | 1 | 11 |
| 2013 | 9 | 11 |
| 2014 | 11 | 13 |
| 2015 | 12 | 24 |
| 2016 | 16 | 10 |
| 2017 | 15 | 13 |
| 2018 | 11 | 23 |
| 2019 | 17 | 12 |
| 2020 | 14 | 23 |
| 2021 | 13 | 24 |
| 2022 | 17 | 28 |
| 2023 | 22 | 28 |
| 2024 | 14 | 24 |
| 2025 | 11 | 44 |
| 2026 | 19 | 18 |
By publication year. 2026 runs to 8 Oct.
Recent patents
- Packaging structure having organic interposer layer and method for manufacturing same6 Oct 2026US 12,757,749 B2SJ Semiconductor(Jiangyin) Corporation
- Display device29 Sep 2026US 12,751,160 B2Samsung Display Co., Ltd.
- Package structure and method for fabricating the same1 Sep 2026US 12,727,477 B2Wistron Neweb Corp.
- Socket for testing semiconductor device18 Aug 2026US 12,710,446 B2Samsung Electronics Co., Ltd.
- Package structure and method of manufacturing the same11 Aug 2026US 12,707,993 B2Advanced Semiconductor Engineering, Inc.
- Circuit device with embedded heat sink24 Sep 2026US 2026/0293668 A1
- Method of manufacturing semiconductor devices, corresponding substrate and semiconductor device3 Sep 2026US 2026/0262529 A1STMicroelectronics International N. V.
- Package and fabrication method thereof20 Aug 2026US 2026/0248036 A1Taiwan Semiconductor Manufacturing Company.Ltd
- Cold plate and electronic device13 Aug 2026US 2026/0239981 A1Wiwynn Corporation
- High voltage isolation package30 Jul 2026US 2026/0223699 A1
Most cited
By later US patents
- Semiconductor chip device with solder diffusion protection101US 8,299,633 B2Advanced Micro Devices, Inc. · 2012
- Integrated fan-out package and method of fabricating the same25US 9,837,359 B1Taiwan Semiconductor Manufacturing Company.Ltd · 2017
- Methods and apparatus for thermal interface material (TIM) bond line thickness (BLT) reduction and TIM adhesion enhancement for efficient thermal management23US 10,529,645 B2Xilinx, Inc. · 2020
- Carbonaceous composite heat spreader and associated methods16US 6,984,888 B22006
- Simultaneous wafer bonding and interconnect joining14US 8,486,758 B2Tessera, Inc. · 2013