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US 12,707,993 B2Granted
Package structure and method of manufacturing the same
AssigneeAdvanced Semiconductor Engineering, Inc.
InventorYing-Chung Chen
Life of this patent
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Abstract
At least some embodiments of the present disclosure relate to an electronic structure. The package structure includes a lead frame, an electronic component, and a conductive wire physically and electrically connecting the electronic component to the lead frame. An elevation of a first end of the conductive wire is substantially equal to an elevation of a second end of the conductive wire.
Claims23
A package structure, comprising:
- a lead frame including a first pin, a second pin, a first conductive pad disposed on the first pin, and a second conductive pad disposed on the second pin;
- an electronic component;
- and
- a conductive wire physically and electrically connecting the electronic component to the lead frame,
- wherein an elevation of a first end of the conductive wire is substantially equal to an elevation of a second end of the conductive wire, and
- wherein a first surface area of the first conductive pad is less than a second surface area of the second conductive pad from a top view.
3 more elements
A package structure, comprising:
- an electronic component;
- at least one pin disposed around the electronic component, wherein the at least one pin has a top surface, a bottom surface opposite to the top surface, a first lateral surface extending between the top surface and the bottom surface, and a second lateral surface opposite to the first lateral surface, wherein the first lateral surface faces the electronic component;
- and
- an encapsulant encapsulating the at least one pin and the electronic component,
- wherein a roughness of the first lateral surface of the at least one pin is greater than a roughness of the second lateral surface of the at least one pin, and
- wherein the at least one pin further comprises a third lateral surface connected to the first lateral surface of the at least one pin, and the third lateral surface of the at least one pin includes a curved surface,
- wherein the encapsulant has a first lateral surface and a second lateral surface, and the first lateral surface of the encapsulant is a vertical surface and the second lateral surface of the encapsulant is a curved surface, and
- wherein the third lateral surface of the at least one pin defines a first recess and the second lateral surface of the encapsulant defines a second recess, and a size of the first recess is greater than a size of the second recess, and wherein the first recess faces the second recess.
5 more elements
Dependencies are inferred from the claim text.