Package and fabrication method thereof

A package, comprising:

• a package component, comprising:
• an interposer structure;
• a top die, bonded to the interposer structure;
• a stress relief structure;
• and
• an encapsulation layer, located between the top die and the stress relief structure, wherein the package component has a stepped structure comprising a portion of a sidewall of the interposer structure, a portion of a sidewall of the top die, a portion of a bottom surface of the top die, a portion of a bottom surface of the encapsulation layer, a portion of a bottom surface of the stress relief structure, and a portion of a sidewall of the stress relief structure.

A fabrication method of a package, comprising:

• bonding a first bonding layer of a first die and a second bonding layer of a carrier structure;
• attaching a second die to the carrier structure;
• forming an encapsulation layer between the first die and the second die, wherein the encapsulation layer surrounds the first die, and the encapsulation layer covers a corner of the first die;
• performing a grooving process to remove the corner of the first die comprising a portion of the first bonding layer and a portion of the second bonding layer, wherein a groove is formed at the corner of the first die;
• and
• performing a singulation process along a cutting line overlapping the second die, wherein the cutting line is separated from the first die.