H10W 72/361
Functions of die-attach connectors, other than mechanically connecting
Official title: {Functions of die-attach connectors, other than mechanically connecting}
H10W72/361 (Functions of die-attach connectors, other than mechanically connecting) appears on 68 US grants and 119 published applications in this corpus.
Search patents in H10W- Granted patents
- 68
- Published applications
- 119
- Assignees
- 55
- Inventors
- 269
- Latest grant
- 14 Jul 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 2011 | 0 | 1 |
| 2012 | 1 | 3 |
| 2013 | 2 | 4 |
| 2014 | 1 | 3 |
| 2015 | 3 | 7 |
| 2016 | 3 | 6 |
| 2017 | 7 | 6 |
| 2018 | 5 | 6 |
| 2019 | 8 | 5 |
| 2020 | 4 | 4 |
| 2021 | 2 | 8 |
| 2022 | 6 | 12 |
| 2023 | 7 | 11 |
| 2024 | 7 | 16 |
| 2025 | 6 | 10 |
| 2026 | 6 | 17 |
By publication year. 2026 runs to 8 Oct.
Subgroups
Granted patents
Recent patents
- Semiconductor package14 Jul 2026US 12,685,154 B2Samsung Electronics Co., Ltd.
- Electronic package and substrate structure thereof14 Jul 2026US 12,685,155 B2Siliconware Precision Industries Co., Ltd.
- Light-emitting device and method of manufacturing light-emitting device7 Jul 2026US 12,677,512 B2Nichia Corporation
- Flexible electronic circuits with support structures21 Apr 2026US 12,610,823 B2Pragmatic Semiconductor Limited
- Display device17 Mar 2026US 12,581,812 B2Sharp Kabushiki Kaisha
- Creating a sintering metallization layer on exposed surfaces of silicon dies for dsmbgas to enhance heat dissipation8 Oct 2026US 2026/0314403 A1Qorvo US, Inc.
- Semiconductor device1 Oct 2026US 2026/0305334 A1Fuji Electric Co., Ltd.
- Semiconductor device and vehicle3 Sep 2026US 2026/0262497 A1Rohm Co., Ltd.
- Water-cooled heat dissipation structure capable of being designed in compact size27 Aug 2026US 2026/0255964 A1Youngyeil Precision Co., Ltd.
- Heat Flow Control Device of Semiconductor Package, Semiconductor Package including the Heat Flow Control Device, and Semiconductor Module including the Semiconductor Package13 Aug 2026US 2026/0239971 A1Lx Semicon Co., Ltd.
Most cited
By later US patents
- Chemical mechanical polishing for hybrid bonding165US 10,840,205 B2Invensas Bonding Technologies, Inc. · 2020
- Multichip modules and methods of fabrication66US 9,666,559 B2Invensas Corporation · 2017
- 3DIC packaging with hot spot thermal management features16US 10,461,009 B2Taiwan Semiconductor Manufacturing Company.Ltd · 2019
- 3DIC packaging with hot spot thermal management features12US 9,735,082 B2Taiwan Semiconductor Manufacturing Company.Ltd · 2017
- Warpage control in package-on-package structures11US 9,559,064 B2Taiwan Semiconductor Manufacturing Company.Ltd · 2017