Electronic package and substrate structure thereof
AssigneeSiliconware Precision Industries Co., Ltd.
InventorsPin-Jing Su, Wen-Yu Teng, Liang-Yi Hung, Chia-Cheng Chen, Yu-Po Wang
Life of this patent
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Abstract
An electronic package and a substrate structure thereof are provided, in which an electronic element and a flow stopper surrounding the electronic element are disposed on a substrate body of the substrate structure, and a heat dissipation structure is bonded on the electronic element via a heat dissipation material, so that the flow stopper limits an overflow range of the heat dissipation material to prevent the heat dissipation material from contaminating a circuit layer on the substrate body.
Claims15
A substrate structure, comprising:
- a substrate body having a first side and a second side opposing the first side, a packaging area, a concentrating area adjacent to the packaging area and a functional area adjacent to the concentrating area being defined on the first side, wherein the first side has a circuit layer formed thereon, and the circuit layer has a plurality of conductive parts located on the functional area;
- and
- a flow stopper disposed on the concentrating area of the first side of the substrate body, wherein the flow stopper has a discontinuous ring shape to form a plurality of dams or recesses, and a gap is formed between adjacent ones of the dams or recesses, wherein an arrangement of the plurality of dams or recesses corresponds to positions of the plurality of conductive parts, so that a position of a single dam or recess corresponds to a position of a single conductive part.
An electronic package, comprising:
- a substrate structure including a substrate body and a flow stopper, wherein the substrate body has a first side and a second side opposing the first side, wherein a packaging area, a concentrating area adjacent to the packaging area, and a functional area adjacent to the concentrating area are defined on the first side, wherein the first side has a circuit layer formed thereon, wherein the circuit layer has a plurality of conductive parts located on the functional area, and wherein the flow stopper is disposed on the concentrating area of the first side of the substrate body;
- an electronic element disposed on the packaging area of the first side of the substrate body and electrically connected to the circuit layer;
- and
- a heat dissipation structure bonded on the electronic element via a heat dissipation material, wherein the heat dissipation material is further formed on the concentrating area.
Dependencies are inferred from the claim text.