Light-emitting device and method of manufacturing light-emitting device

A method of manufacturing a light-emitting device, the method comprising steps of:

• preparing a light-emitting element mounted substrate that comprises:
• a light-emitting element having an upper surface serving as a light extracting surface, a lower surface located on a side opposite the upper surface, and a lateral surface connecting the upper surface and the lower surface, wherein the light-emitting element comprises an element electrode located on the lower surface, and
• a substrate,
• wherein the element electrode and the substrate are electrically joined through a metal post;
• depositing an adhesive resin on the upper surface of the light-emitting element;
• mounting a transmissive member on the adhesive resin;
• and
• forming a light reflective member that directly or indirectly covers the substrate and the light-emitting element, wherein:
• in the step of mounting the transmissive member, the adhesive resin is located between the upper surface of the light-emitting element and the transmissive member, on the lateral surface of the light-emitting element, and on a peripheral area of the lower surface of the light-emitting element,
• in the step of preparing the light-emitting element mounted substrate, the metal post includes a recessed portion on at least a portion of a lateral surface of the metal post, and
• in the step of mounting the transmissive member, the adhesive resin is located at a position that enters the recessed portion of the metal post so as to continue from the peripheral area of the lower surface of the light-emitting element or at the lateral surface of the metal post so as to continue from the peripheral area of the lower surface of the light-emitting element.

A light-emitting device comprising:

• a light-emitting element having an upper surface serving as a light extracting surface, a lower surface located on a side opposite the upper surface, and a lateral surface connecting the upper surface and the lower surface, wherein the light-emitting element comprises an element electrode located at the lower surface;
• a substrate comprising a wiring electrically connected to the element electrode;
• a metal post located between the element electrode and the wiring;
• a transmissive member configured to allow light from the light-emitting element to pass therethrough;
• and
• an adhesive resin located between the upper surface of the light-emitting element and the transmissive member, wherein:
• a portion of the adhesive resin is located on the lateral surface of the light-emitting element and on a peripheral area of the lower surface of the light-emitting element, and
• the adhesive resin is further located so as to continue from the lower surface of the light-emitting element to a lateral surface of the metal post.