Heat Flow Control Device of Semiconductor Package, Semiconductor Package including the Heat Flow Control Device, and Semiconductor Module including the Semiconductor Package

A semiconductor package, comprising:

• a first semiconductor device disposed on a first package substrate;
• a heat flow control device disposed above the first semiconductor device;
• and
• a second semiconductor device disposed spaced apart from the first heat flow control device at a lateral side of the first heat flow control device;
• wherein the heat flow control device comprises:
• a heat flow control body having a lower surface configured to face a heat generating semiconductor device;
• and
• a heat flow control layer disposed on a lateral side of the heat flow control body configured to face a heat-sensitive semiconductor device, wherein the heat flow control layer has a lower thermal conductivity than the heat flow control body.

A semiconductor module comprising:

• a semiconductor package, comprising:
• a first semiconductor device disposed on a first package substrate;
• a heat flow control device disposed above the first semiconductor device;
• and
• a second semiconductor device disposed spaced apart from of the first heat flow control device at a lateral side of the first heat flow control device;
• wherein the heat flow control device comprises:
• a heat flow control body having a lower surface configured to face a heat generating semiconductor device;
• and
• a heat flow control layer disposed on a lateral side of the heat flow control body configured to face a heat-sensitive semiconductor device, wherein the heat flow control layer has a lower thermal conductivity than the heat flow control body.