H10W 72/365
Providing thermal transfer
Official title: {Providing thermal transfer}
H10W72/365 (Providing thermal transfer) appears on 43 US grants and 81 published applications in this corpus.
Search patents in H10W- Granted patents
- 43
- Published applications
- 81
- Assignees
- 33
- Inventors
- 191
- Latest grant
- 14 Jul 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 2012 | 1 | 2 |
| 2013 | 1 | 3 |
| 2014 | 0 | 2 |
| 2015 | 1 | 5 |
| 2016 | 3 | 3 |
| 2017 | 4 | 5 |
| 2018 | 3 | 4 |
| 2019 | 7 | 3 |
| 2020 | 3 | 4 |
| 2021 | 2 | 4 |
| 2022 | 4 | 7 |
| 2023 | 5 | 6 |
| 2024 | 4 | 8 |
| 2025 | 1 | 9 |
| 2026 | 4 | 16 |
By publication year. 2026 runs to 8 Oct.
Recent patents
- Semiconductor package14 Jul 2026US 12,685,154 B2Samsung Electronics Co., Ltd.
- Electronic package and substrate structure thereof14 Jul 2026US 12,685,155 B2Siliconware Precision Industries Co., Ltd.
- Light-emitting device and method of manufacturing light-emitting device7 Jul 2026US 12,677,512 B2Nichia Corporation
- Integrated circuit package and method10 Feb 2026US 12,550,793 B2Taiwan Semiconductor Manufacturing Company.Ltd
- Semiconductor structure and method of forming the same1 Apr 2025US 12,266,633 B2Taiwan Semiconductor Manufacturing Company.Ltd
- Creating a sintering metallization layer on exposed surfaces of silicon dies for dsmbgas to enhance heat dissipation8 Oct 2026US 2026/0314403 A1Qorvo US, Inc.
- Semiconductor device1 Oct 2026US 2026/0305334 A1Fuji Electric Co., Ltd.
- Semiconductor device and vehicle3 Sep 2026US 2026/0262497 A1Rohm Co., Ltd.
- Water-cooled heat dissipation structure capable of being designed in compact size27 Aug 2026US 2026/0255964 A1Youngyeil Precision Co., Ltd.
- Heat Flow Control Device of Semiconductor Package, Semiconductor Package including the Heat Flow Control Device, and Semiconductor Module including the Semiconductor Package13 Aug 2026US 2026/0239971 A1Lx Semicon Co., Ltd.
Most cited
By later US patents
- 3DIC packaging with hot spot thermal management features16US 10,461,009 B2Taiwan Semiconductor Manufacturing Company.Ltd · 2019
- 3DIC packaging with hot spot thermal management features12US 9,735,082 B2Taiwan Semiconductor Manufacturing Company.Ltd · 2017
- Warpage control in package-on-package structures11US 9,559,064 B2Taiwan Semiconductor Manufacturing Company.Ltd · 2017
- Exposed die package for direct surface mounting9US 8,304,871 B2Texas Instruments Incorporated · 2012
- Exposed die package for direct surface mounting6US 8,470,644 B2Texas Instruments Incorporated · 2013