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US 9,559,064 B2Granted
Warpage control in package-on-package structures
AssigneeTaiwan Semiconductor Manufacturing Company, Ltd.
InventorsWei-Yu Chen, Yu-Hsiang (James) Hu, Wei-Hung Lin, Ming-Da Cheng, Chung-Shi Liu
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Abstract
A package includes a bottom substrate and a bottom die over and bonded to the bottom substrate. A metal-particle-containing compound material is overlying a top surface of the bottom die, wherein the metal-particle-containing compound material comprises metal particles. A molding material molds at least a lower part of the bottom die therein, wherein the molding material is overlying the bottom substrate.
Claims20
A package comprising:
- a bottom package comprising:
- a package substrate;
- and
- a device die over and bonded to the package substrate;
- a metal-particle-containing compound material over a top surface of the device die;
- a rigid plate over and contacting the metal-particle-containing compound material;
- a molding compound over the package substrate, wherein an entirety of the molding compound is lower than a top surface of the device die;
- and
- a top package bonded to the bottom package through solder regions penetrating through the molding compound.
6 more elements
A method comprising:
- bonding a device die over a package substrate;
- applying a metal-containing paste over a top surface of the device die;
- placing a rigid non-metal plate over and contacting the metal-containing paste;
- curing the metal-containing paste;
- and
- after curing the metal-containing paste, molding the device die in a molding compound, wherein the molding compound includes a portion overlying the package substrate, with a top surface of the device die exposed through the molding compound, wherein an entirety of the molding compound is lower than the top surface of the device die.
3 more elements
A package comprising:
- a bottom package comprising:
- a package substrate;
- and
- a device die over and bonded to the package substrate;
- a metal-particle-containing compound material over a top surface of the device die, wherein the metal-particle-containing compound material comprises metal particles mixed in an adhesive;
- a rigid plate over and contacting the metal-particle-containing compound material;
- a molding compound over the package substrate and molding a lower portion of the device die therein, wherein all top surfaces of the molding compound are lower than a top surface of the device die;
- and
- a top package bonded to the bottom package through solder regions penetrating through the molding compound.
6 more elements
Dependencies are inferred from the claim text.