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US 9,735,082 B2Granted
3DIC packaging with hot spot thermal management features
AssigneeTaiwan Semiconductor Manufacturing Company, Ltd.
InventorsWensen Hung, Szu-Po Huang, Hsiang-Fan Lee, Kim Hong Chen, Chi-Hsi Wu, Shin-Puu Jeng
Life of this patent
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Abstract
A package includes a substrate having a conductive layer, and the conductive layer comprises an exposed portion. A die stack is disposed over the substrate and electrically connected to the conductive layer. A high thermal conductivity material is disposed over the substrate and contacting the exposed portion of the conductive layer. The package further includes a contour ring over and contacting the high thermal conductivity material.
Claims19
A package comprising:
- a substrate comprising a conductive layer, wherein the conductive layer comprises an exposed portion of a power, ground, or signal layer;
- a die stack over the substrate and electrically connected to the conductive layer, wherein the die stack comprises one or more top dies bonded to a bottom die;
- an additional die stack over the substrate and adjacent the die stack, wherein the die stack extends higher than the additional die stack;
- a high thermal conductivity material over the substrate and contacting an electrically conductive material of the exposed portion of the power, ground, or signal layer;
- an additional high thermal conductivity material, wherein the additional high thermal conductivity material is adjacent the bottom die, and wherein a line perpendicular to a top surface of the substrate extends through the substrate, the additional high thermal conductivity material, and the one or more top dies;
- a contour ring over and contacting the high thermal conductivity material;
- and
- a heat dissipation feature covering the die stack and the additional die stack, wherein a first bottom surface of the heat dissipation feature over the die stack is higher than a second bottom surface of the heat dissipation feature over the additional die stack.
5 more elements
A package comprising:
- a substrate comprising a first conductive layer and a second conductive layer;
- a first die stack comprising one or more top dies electrically connected to a bottom die, wherein the bottom die comprises:
- a first logic core electrically connected to the first conductive layer;
- and
- a second logic core electrically connected to the second conductive layer;
- a first high thermal conductivity material over the substrate and contacting an electrically conductive material of the first conductive layer;
- a second high thermal conductivity material over the substrate and contacting the second conductive layer;
- and
- a heat dissipation feature over and contacting the first high thermal conductivity material and the second high thermal conductivity material.
6 more elements
A method comprising:
- forming a conductive layer at a front side of a package substrate;
- forming a solder resist over the front side of the package substrate;
- patterning the solder resist to expose a portion of the conductive layer;
- attaching a die stack to the front side of the package substrate, wherein the die stack is electrically connected to the conductive layer;
- disposing a high thermal conductivity material over and physically contacting an electrically conductive material of the portion of the conductive layer;
- and
- after disposing the high thermal conductivity material over and physically contacting the electrically conductive material, attaching a heat dissipation feature to the front side of the package substrate using an adhesive having a lower thermal conductivity than the high thermal conductivity material, wherein the heat dissipation feature is in physical contact with the high thermal conductivity material, and wherein the adhesive extends along opposing sidewalls of the high thermal conductivity material.
4 more elements
Dependencies are inferred from the claim text.