Water-cooled heat dissipation structure capable of being designed in compact size
AssigneeYoungyeil Precision Co., Ltd.
InventorDong Wook CHU
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Abstract
A water-cooled heat dissipation structure capable of being designed in a compact size and also capable of rapidly cooling a semiconductor chip is described. In the water-cooled heat dissipation structure, a first side wall portion and a plurality of fins are formed such that the first side wall portion and the plurality of fins have the same height, so that a space between a heat dissipation plate and a blocking plate is minimized, thereby being capable of designing the entire structure in a compact size.
Claims9
A water-cooled heat dissipation structure capable of being designed in a compact size, the water-cooled heat dissipation structure comprising:
- a heat dissipation plate in contact with a semiconductor chip connected to a board;
- and
- a blocking plate formed such that the blocking plate covers the heat dissipation plate, the blocking plate having a first side provided with an inlet hole and having a second side provided with an outlet hole,
- wherein a watertight space portion is formed between the heat dissipation plate and the blocking plate, and
- wherein heat of a refrigerant that is introduced into the space portion through the inlet hole is exchanged with heat of the heat dissipation plate, and then the refrigerant is discharged outside the space portion through the outlet hole.
Dependencies are inferred from the claim text.