H10W 72/367
Multiple die-attach connectors having different functions
Official title: {Multiple die-attach connectors having different functions}
H10W72/367 (Multiple die-attach connectors having different functions) appears on 67 US grants and 104 published applications in this corpus.
Search patents in H10W- Granted patents
- 67
- Published applications
- 104
- Assignees
- 45
- Inventors
- 230
- Latest grant
- 14 Jul 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 2011 | 0 | 1 |
| 2012 | 1 | 3 |
| 2013 | 2 | 4 |
| 2014 | 1 | 3 |
| 2015 | 3 | 7 |
| 2016 | 3 | 6 |
| 2017 | 7 | 6 |
| 2018 | 5 | 6 |
| 2019 | 8 | 5 |
| 2020 | 4 | 4 |
| 2021 | 2 | 8 |
| 2022 | 6 | 12 |
| 2023 | 7 | 8 |
| 2024 | 7 | 16 |
| 2025 | 6 | 10 |
| 2026 | 5 | 5 |
By publication year. 2026 runs to 8 Oct.
Recent patents
- Semiconductor package14 Jul 2026US 12,685,154 B2Samsung Electronics Co., Ltd.
- Electronic package and substrate structure thereof14 Jul 2026US 12,685,155 B2Siliconware Precision Industries Co., Ltd.
- Flexible electronic circuits with support structures21 Apr 2026US 12,610,823 B2Pragmatic Semiconductor Limited
- Display device17 Mar 2026US 12,581,812 B2Sharp Kabushiki Kaisha
- Integrated circuit package and method10 Feb 2026US 12,550,793 B2Taiwan Semiconductor Manufacturing Company.Ltd
- Semiconductor package and method of manufacturing the same18 Jun 2026US 2026/0173874 A1Samsung Electronics Co., Ltd.
- Integrated circuit package and method14 May 2026US 2026/0137006 A1Taiwan Semiconductor Manufacturing Company.Ltd
- Lid Design and Process for Dispensable Liquid Metal Thermal Interface Material30 Apr 2026US 2026/0123410 A1Apple Inc.
- Semiconductor package19 Mar 2026US 2026/0083007 A1Samsung Electronics Co., Ltd.
- Heterogenous Thermal Interface Material8 Jan 2026US 2026/0011677 A1Google Inc.
Most cited
By later US patents
- Chemical mechanical polishing for hybrid bonding165US 10,840,205 B2Invensas Bonding Technologies, Inc. · 2020
- Multichip modules and methods of fabrication66US 9,666,559 B2Invensas Corporation · 2017
- 3DIC packaging with hot spot thermal management features16US 10,461,009 B2Taiwan Semiconductor Manufacturing Company.Ltd · 2019
- 3DIC packaging with hot spot thermal management features12US 9,735,082 B2Taiwan Semiconductor Manufacturing Company.Ltd · 2017
- Warpage control in package-on-package structures11US 9,559,064 B2Taiwan Semiconductor Manufacturing Company.Ltd · 2017