H10W 72/331
Shapes of die-attach connectors
Official title: {Shapes of die-attach connectors}
H10W72/331 (Shapes of die-attach connectors) appears on 1,729 US grants and 2,089 published applications in this corpus.
Search patents in H10W- Granted patents
- 1,729
- Published applications
- 2,089
- Assignees
- 532
- Inventors
- 3,967
- Latest grant
- 6 Oct 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1983 | 1 | 0 |
| 1984 | 1 | 0 |
| 1985 | 2 | 0 |
| 1986 | 2 | 0 |
| 1987 | 1 | 0 |
| 1988 | 0 | 0 |
| 1989 | 2 | 0 |
| 1990 | 4 | 0 |
| 1991 | 1 | 0 |
| 1992 | 6 | 0 |
| 1993 | 4 | 0 |
| 1994 | 4 | 0 |
| 1995 | 5 | 0 |
| 1996 | 7 | 0 |
| 1997 | 11 | 0 |
| 1998 | 13 | 0 |
| 1999 | 16 | 0 |
| 2000 | 19 | 0 |
| 2001 | 34 | 16 |
| 2002 | 28 | 47 |
| 2003 | 26 | 33 |
| 2004 | 42 | 51 |
| 2005 | 33 | 33 |
| 2006 | 35 | 46 |
| 2007 | 35 | 61 |
| 2008 | 25 | 52 |
| 2009 | 24 | 45 |
| 2010 | 56 | 63 |
| 2011 | 45 | 68 |
| 2012 | 44 | 82 |
| 2013 | 78 | 53 |
| 2014 | 78 | 93 |
| 2015 | 77 | 100 |
| 2016 | 69 | 89 |
| 2017 | 95 | 89 |
| 2018 | 71 | 80 |
| 2019 | 85 | 96 |
| 2020 | 89 | 164 |
| 2021 | 89 | 143 |
| 2022 | 109 | 146 |
| 2023 | 103 | 111 |
| 2024 | 108 | 131 |
| 2025 | 84 | 124 |
| 2026 | 68 | 73 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Subgroups
Granted patents
Recent patents
- Patterned sheet MUF for complex packages and methods of producing6 Oct 2026US 12,757,781 B2Intel Corporation
- Anchor-containing underfill structures for a chip package and methods of forming the same29 Sep 2026US 12,751,304 B2Taiwan Semiconductor Manufacturing Company.Ltd
- Display apparatus29 Sep 2026US 12,751,319 B2LG Display Co., Ltd.
- Electronic devices and methods of manufacturing electronic devices22 Sep 2026US 12,745,629 B2Amkor Technology Singapore Holding Pte.Ltd.
- Semiconductor package with reduced adhesive fillets22 Sep 2026US 12,745,680 B2Samsung Electronics Co., Ltd.
- Semiconductor structure and methods of manufacturing the same1 Oct 2026US 2026/0305394 A1Taiwan Semiconductor Manufacturing Company.Ltd
- Electronic module1 Oct 2026US 2026/0305442 A1Shindengen Electric Manufacturing Co., Ltd.
- Die attachment film, dicing die bonding film, and semiconductor device manufacturing method1 Oct 2026US 2026/0305443 A1Resonac Corporation
- Semiconductor package1 Oct 2026US 2026/0305477 A1Samsung Electronics Co., Ltd.
- Semiconductor device and manufacturing method for semiconductor device24 Sep 2026US 2026/0293739 A1Kioxia Corporation
Most cited
By later US patents
- Fabrication process of semiconductor package and semiconductor package390US 5,976,912 AHitachi Chemical Company, Ltd. · 1999
- Leadframe for use in manufacturing a resin-molded semiconductor device295US 6,208,020 B1Matsushita Electronics Corporation · 2001
- Semiconductor devices having protective layers thereon through which contact pads are exposed and stereolithographic methods of fabricating such semiconductor devices266US 6,326,698 B1Micron Technology, Inc. · 2001
- Pad array semiconductor device264US 5,592,025 AMotorola, Inc. · 1997
- Resin-sealed semiconductor device, circuit member used therefor245US 6,201,292 B1Dai Nippon Insatsu Kabushiki Kaisha · 2001