Electronic module

Abstract

An electronic module includes an electronic element, an internal connection terminal electrically connected with the electronic element and having electrical conductivity, and a chip spacer formed between a lower end surface of the internal connection terminal and the electronic element. The chip spacer is bonded to the electronic element via an electrically conductive bonding material BM1, and a recess having a diameter larger than the internal connection terminal is formed on an upper surface of the chip spacer. According to the electronic module, the positional displacement between the internal connection terminal and the chip spacer is prevented and hence, a self-alignment effect can be enhanced as desired.

Dependencies are inferred from the claim text.