Semiconductor package with reduced adhesive fillets

A semiconductor package comprising:

• a base chip;
• a first semiconductor chip on the base chip;
• first bump structures electrically connecting the base chip and the first semiconductor chip to each other;
• a second semiconductor chip on the first semiconductor chip;
• second bump structures electrically connecting the first semiconductor chip and the second semiconductor chip to each other;
• a first adhesive layer surrounding the second bump structures below the second semiconductor chip;
• and
• an encapsulant surrounding the first bump structures below the first semiconductor chip, the encapsulant covering a first side surface of the first semiconductor chip, a second side surface of the second semiconductor chip, and a side surface of the first adhesive layer,
• wherein the first side surface of the first semiconductor chip, the second side surface of the second semiconductor chip, and the side surface of the first adhesive layer are coplanar with each other, and
• wherein a first distance between the base chip and the first semiconductor chip is greater than a second distance between the first semiconductor chip and the second semiconductor chip.

A semiconductor package comprising:

• a base chip;
• a plurality of semiconductor chips sequentially stacked on the base chip;
• bump structures between the base chip and a lowermost semiconductor chip, among the plurality of semiconductor chips, the bump structures between the plurality of semiconductor chips;
• at least one adhesive layer surrounding some bump structures, among the bump structures, between the plurality of semiconductor chips;
• and
• an encapsulant surrounding some bump structures, among the bump structures, between the base chip and the lowermost semiconductor chip, the encapsulant in direct contact with a side surface of each of the plurality of semiconductor chips and a side surface of the at least one adhesive layer,
• wherein a first distance between the base chip and the lowermost semiconductor chip is greater than a second distance between the lowermost semiconductor chip and a second semiconductor chip of the plurality of semiconductor chips on the lowermost semiconductor chip, the second semiconductor chip adjacent to the lowermost semiconductor chip in the plurality of semiconductor chips stacked on the base chip.