Semiconductor devices having protective layers thereon through which contact pads are exposed and stereolithographic methods of fabricating such semiconductor devices
AssigneeMicron Technology, Inc.
InventorSalman Akram
Life of this patent
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Abstract
A method for forming packaged substrates, including flip-chip dice individually or in a multi-die wafer. The method includes using a stereolithographic process to form a protective dielectric polymeric sealing structure on at least the active surface of the substrate. In addition, the invention encompasses forming a similar layer on a second substrate to be joined to the first substrate. Contact pads of the second substrate are exposed through the layer thereon to facilitate joining of the two substrates. Semiconductor devices formed by the method are also disclosed.
Claims54
A method of packaging at least one semiconductor device substrate, comprising:
- providing at least one semiconductor device substrate with at least one contact pad exposed to an active surface thereof;
- submerging said at least one substrate in a photopolymeric liquid material to a depth forming a thin layer thereof on at least a portion of said active surface;
- and
- selectively subjecting said thin layer of photopolymeric liquid material to polymerizing radiation to form a layer comprising at least semisolid polymer material on said active surface.
A method for forming sealed electrical connections between at least one flip-chip type semiconductor die and a substrate, comprising the steps of:
- providing at least one semiconductor die having an active surface with at least one bond pad exposed thereto;
- securing at least one conductive structure to said at least one bond pad;
- stereolithographically forming a layer of at least semisolid polymeric material on said active surface so as to permit said at least one conductive structure to protrude from said layer upon said securing;
- providing a substrate having a surface with at least one corresponding contact pad located correspondingly to said at least one bond pad;
- forming a layer of polymeric material on said surface of said substrate, said at least one corresponding contact pad being exposed through said layer of polymeric material;
- aligning said at least one bond pad with said at least one corresponding contact pad;
- and
- connecting said at least one bond pad to said at least one corresponding contact pad with said at least one conductive structures.
A method for packaging a plurality of semiconductor devices, comprising:
- providing a wafer with a plurality of semiconductor devices, each having an active surface with at least one bond pad thereon;
- defining peripheries of selected ones of said plurality of semiconductor devices;
- securing at least one conductive structure to said at least one bond pad;
- placing said wafer at a horizontal plane;
- recognizing a location and orientation of said at least one bond pad of each of said plurality of semiconductor devices of said wafer;
- and
- stereolithographically forming a structure comprising at least one layer of semi-solid material covering said active surface of each semiconductor device so as to permit said at least one conductive structure to protrude therefrom.
A method for disposing material within interstitial spaces on a surface of a substrate, the interstitial spaces being located between conductive structures protruding from the substrate, said method comprising:
- providing a first substrate with conductive structures protruding from a surface thereof;
- stereolithographically forming at least one first substantially void-free layer of photopolymeric material on said surface including within interstitial spaces;
- providing a second substrate having a surface with contact pads located correspondingly to positions of said conductive structures on said surface of said first substrate;
- stereolithographically forming at least one second substantially void-free layer of photopolymeric material on said surface of said second substrate with said contact pads being exposed therethrough;
- and
- joining said conductive structures to said contact pads.
A semiconductor device assembly comprising:
- a first substrate having a first active surface with at least one first contact pad exposed thereto;
- at least one first layer of at least semisolid photopolymer material on said first active surface, said at least one first contact pad being electrically exposed through said at least one first layer;
- a second substrate having a second active surface with at least one second contact pad exposed thereto;
- at least one second layer of at least semisolid photopolymer material on said second active surface, said at least one second contact pad being electrically exposed through said at least one second layer and located on said second active surface to correspond to a position of said at least one first contact pad on said first active surface, said at least one second layer contacting said at least one first layer;
- and
- at least one conductive structure disposed in contact with said at least one first contact pad and said at least one second contact pad, said at least one conductive structure being laterally surrounded by at least semisolid photopolymer material.
A packaged semiconductor device, comprising:
- a substrate having an active surface with at least one contact pad exposed thereto;
- and
- a plurality of layers of at least semisolid photopolymer material on said active surface, said plurality of layers being superimposed, contiguous, and mutually adhered, each layer of said plurality of layers being substantially free of internal voids, said at least one contact pad being electrically exposed through said plurality of layers.
Dependencies are inferred from the claim text.