H10W 72/337
Multiple die-attach connectors having different shapes
Official title: {Multiple die-attach connectors having different shapes}
H10W72/337 (Multiple die-attach connectors having different shapes) appears on 88 US grants and 135 published applications in this corpus.
Search patents in H10W- Granted patents
- 88
- Published applications
- 135
- Assignees
- 69
- Inventors
- 309
- Latest grant
- 1 Sep 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 2002 | 0 | 2 |
| 2003 | 0 | 0 |
| 2004 | 0 | 0 |
| 2005 | 1 | 1 |
| 2006 | 2 | 1 |
| 2007 | 1 | 0 |
| 2008 | 0 | 4 |
| 2009 | 0 | 1 |
| 2010 | 0 | 1 |
| 2011 | 1 | 0 |
| 2012 | 1 | 4 |
| 2013 | 3 | 4 |
| 2014 | 4 | 9 |
| 2015 | 5 | 6 |
| 2016 | 5 | 5 |
| 2017 | 9 | 5 |
| 2018 | 3 | 5 |
| 2019 | 7 | 6 |
| 2020 | 6 | 8 |
| 2021 | 3 | 7 |
| 2022 | 5 | 9 |
| 2023 | 4 | 13 |
| 2024 | 8 | 24 |
| 2025 | 8 | 11 |
| 2026 | 12 | 9 |
By publication year. 2026 runs to 8 Oct.
Recent patents
- Package structure and method for fabricating the same1 Sep 2026US 12,727,477 B2Wistron Neweb Corp.
- Package structure and method for manufacturing the same25 Aug 2026US 12,721,198 B2Nanya Technology Corporation
- Semiconductor device comprising metallic film and annular groove provided on the bonding surface4 Aug 2026US 12,702,041 B2Kabushiki Kaisha Toshiba
- Semiconductor package4 Aug 2026US 12,702,067 B2Samsung Electronics Co., Ltd.
- Package with thermal conductive material interspersed in depopulated regions of solder bumps7 Jul 2026US 12,677,658 B2GLOBALFOUNDRIES U. S. Inc.
- Semiconductor package1 Oct 2026US 2026/0305477 A1Samsung Electronics Co., Ltd.
- Semiconductor memory and manufacturing method thereof27 Aug 2026US 2026/0256025 A1Kioxia Corporation
- Integrated circuit23 Jul 2026US 2026/0215317 A1Pragmatic Semiconductor Limited
- Semiconductor package2 Jul 2026US 2026/0190989 A1Samsung Electronics Co., Ltd.
- Semiconductor package and method of manufacturing the same18 Jun 2026US 2026/0173874 A1Samsung Electronics Co., Ltd.
Most cited
By later US patents
- Three dimensional device integration method and integrated device220US 7,126,212 B2Ziptronix, Inc. · 2006
- Three dimensional device integration method and integrated device194US 9,431,368 B2Ziptronix, Inc. · 2016
- Three dimensional device integration method and integrated device107US 6,984,571 B1Ziptronix, Inc. · 2006
- Three dimensional integrated device22US 6,905,557 B2Ziptronix, Inc. · 2005
- Hybrid thermal interface material for IC packages with integrated heat spreader20US 9,472,485 B2Broadcom Corporation · 2016