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US 12,677,658 B2Granted
Package with thermal conductive material interspersed in depopulated regions of solder bumps
AssigneeGlobalFoundries U.S. Inc.
InventorsJohn C. Malinowski, Zhuojie Wu
Life of this patent
Estimating the term…
Abstract
The present disclosure relates to radio frequency (RF) chip packages and, more particularly, to improved thermal performance of RF chip packages and methods of manufacture. The structure includes: a board; a chip substrate; a pattern of solder bumps between the board and the chip substrate; and a thermal conductive material between the chip substrate and the board in depopulated regions of solder bumps of the chip substrate.
Claims17
A structure comprising:
- a board;
- a chip substrate;
- a pattern of solder bumps between the board and the chip substrate;
- a thermal conductive material between the chip substrate and the board in depopulated regions of solder bumps of the chip substrate;
- and
- underfill material provided between the chip substrate and the board and interspersed within the pattern of solder bumps, wherein the board is a redistribution layer connected to both the chip substrate and a second board, and the thermal conductive material is in contact with the redistribution layer and the second board.
3 more elements
A structure comprising:
- a first board;
- a second board;
- a ball grid array connecting the first board to the second board;
- a thermal conductive material between the first board and the second board in regions which are devoid of the ball grid array;
- underfill material provided between the first board and the second board and interspersed within the ball grid array and contacting the thermal conductive material in the regions which are devoid of the ball grid array;
- and
- a chip substrate, wherein the first board is a redistribution layer connected to both the chip substrate and the second board, and the thermal conductive material is in contact with the redistribution layer and the second board.
4 more elements
A method comprising:
- placing thermal conductive material in regions of one of a chip substrate and a board that is devoid of solder bumps;
- placing underfill material between a first board and a second board and interspersed within the solder bumps and contacting the thermal conductive material in the regions which are devoid of solder bumps;
- and
- connecting the chip substrate to the board by applying a force such that the thermal conductive material is squeezed and in physical contact with both the chip substrate and the board,
- wherein the first board is a redistribution layer connected to both the chip substrate and the second board, and the thermal conductive material is in contact with the redistribution layer and the second board.
2 more elements
Dependencies are inferred from the claim text.