Package structure and method for manufacturing the same

A package structure, comprising:

• a first substrate including a first patterned circuit layer and defining a first through hole;
• a first electronic component disposed over the first through hole of the first substrate, wherein the first electronic component is electrically connected to the first patterned circuit layer of the first substrate through an extending portion of the first patterned circuit layer extending beyond a sidewall of the first through hole;
• a second substrate including a second patterned circuit layer and defining a second through hole;
• a second electronic component disposed over the second through hole of the second substrate, wherein the second electronic component is electrically connected to the second patterned circuit layer of the second substrate through an inner extending portion of the second patterned circuit layer extending beyond a sidewall of the second through hole;
• and
• an intermediate adhesion layer formed between the second substrate is adhered to the first electronic component to adhere the second substrate to the first electronic component;
• at least one external connector disposed adjacent to a second surface of the first substrate, and electrically connected to the first patterned circuit layer through at least one through via in the first substrate.