Hybrid thermal interface material for IC packages with integrated heat spreader
AssigneeBroadcom Corporation
InventorsMehdi Saeidi, Sam Ziqun Zhao
Life of this patent
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Abstract
Flip chip packages are described that include two or more thermal interface materials (TIMs). A die is mounted to a substrate by solder bumps. A first TIM is applied to the die, and has a first thermal resistance. A second TIM is applied to the die and/or the substrate, and has a second thermal resistance that is greater than the first thermal resistance. An open end of a heat spreader lid is mounted to the substrate such that the die is positioned in an enclosure formed by the heat spreader lid and substrate. The first TIM and the second TIM are each in contact with an inner surface of the heat spreader lid. A ring-shaped stiffener may surround the die and be connected between the substrate and heat spreader lid by the second TIM.
Claims20
A method for assembling an integrated circuit package, comprising:
- applying, on an integrated circuit die having opposing first and second surfaces and mounted to a first surface of a substrate, a first thermal interface material (TIM) on the second surface of the die, the first TIM having a first thermal resistance;
- applying a second TIM to the first surface of the substrate to be separated from the die by a gap, the second TIM having a second thermal resistance that is greater than the first thermal resistance;
- and
- mounting an open end of a heat spreader lid to the first surface of the substrate such that the die is positioned in an enclosure formed by the heat spreader lid and substrate, the first TIM and the second TIM each being in contact with an inner surface of the heat spreader lid.
An integrated circuit (IC) package, comprising:
- a substrate having opposing first and second surfaces;
- an IC die having opposing first and second surfaces, wherein the first surface of the die is flip chip mounted to the first surface of the substrate;
- a first thermal interface material (TIM) on the second surface of the die, the first TIM having a first thermal resistance;
- a heat spreader lid having an open end mounted to the first surface of the substrate such that the die is positioned in an enclosure formed by the heat spreader lid and substrate, the first TIM being in contact with an inner surface of the heat spreader lid;
- and
- a second TIM coupled between the first surface of the substrate and the inner surface of the heat spreader lid, and is separated from an edge of the die by a gap, the second TIM having a second thermal resistance that is greater than the first thermal resistance.
An integrated circuit (IC) package, comprising:
- a substrate having opposing first and second surfaces;
- an IC die having opposing first and second surfaces, wherein the first surface of the die is mounted to the first surface of the substrate;
- a first thermal interface material (TIM) on the second surface of the die, the first TIM having a first thermal resistance;
- a heat spreader lid having an open end mounted to the first surface of the substrate such that the die is positioned in an enclosure formed by the heat spreader lid and substrate, the first TIM being in contact with an inner surface of the heat spreader lid;
- a second TIM coupled between the first surface of the substrate and the inner surface of the heat spreader lid, the second TIM having a second thermal resistance that is greater than the first thermal resistance, the second TIM forming a ring around the die that is separated from an edge of the die by a gap.
Dependencies are inferred from the claim text.