Semiconductor device and manufacturing method for semiconductor device

A semiconductor device comprising:

• a circuit board comprising a first pad;
• a semiconductor element provided on the circuit board via a first adhesive layer;
• and
• a first bonding wire connecting the circuit board and the first semiconductor element, wherein
• the first adhesive layer comprises a portion which does not overlap with the first semiconductor on the first pad side in a stacking direction of the first adhesive layer and the first semiconductor element, and
• the first bonding wire is in direct contact with the first adhesive layer.

A manufacturing method for a semiconductor device comprising:

• adhering a first semiconductor element on a circuit board via a first adhesive layer;
• and
• forming a first bonding wire which connects the first semiconductor element and the circuit board, wherein
• the adhering is procced so that a first distance becomes longer than a second distance,
• the first distance is a length between a connection surface between the first adhesive layer and the first semiconductor element and a location on the opposite side of the first adhesive layer on the furthest opposite side of the circuit board, and
• the second distance is a length between a surface of the first semiconductor element on the opposite side of the circuit board and the connection surface between the first adhesive layer and the first semiconductor element.