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US 12,757,781 B2Granted
Patterned sheet MUF for complex packages and methods of producing
AssigneeIntel Corporation
InventorsZhixin Xie, Jung Kyu Han, Gang Duan
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Abstract
Embodiments disclosed herein include electronic packages. In an embodiment, the electronic package comprises a package substrate with a die coupled to the package substrate by a plurality of interconnects. In an embodiment, a first layer is on the package substrate surrounding the die, and a second layer is over and around the die. In an embodiment, the second layer underfills the plurality of interconnects, and the second layer has a different material composition than the first layer.
Claims20
An electronic package, comprising:
- a package substrate;
- a die coupled to the package substrate by a plurality of interconnects;
- a first layer on the package substrate surrounding the die;
- and
- a second layer over and around the die, wherein the second layer underfills the plurality of interconnects, wherein the second layer has a different material composition than the first layer, and wherein the second layer laterally separates an entirety of the die from the first layer.
2 more elements
A mold underfill (MUF) sheet, comprising:
- a first mold material with a first composition;
- an opening formed through the first mold material;
- and
- a second mold material in the opening, wherein the second mold material comprises a second composition, and wherein the second mold material laterally separates an entirety of the opening from the first mold material.
1 more element
A computing system, comprising:
- a board;
- a package substrate coupled to the board;
- a die coupled to the package substrate;
- and
- a mold underfill (MUF) disposed over the package substrate and the die, wherein the MUF comprises:
- a first mold material over and around the die;
- and
- a second mold material surrounding the first mold material, and wherein the third mold material laterally separates an entirety of the die from the second mold material.
5 more elements
Dependencies are inferred from the claim text.