H10W 72/335
Of outermost layers of multilayered die-attach connectors
Official title: {of outermost layers of multilayered die-attach connectors, e.g. coating not being conformal on a core}
H10W72/335 (Of outermost layers of multilayered die-attach connectors) appears on 5 US grants and 7 published applications in this corpus.
Search patents in H10W- Granted patents
- 5
- Published applications
- 7
- Assignees
- 6
- Inventors
- 37
- Latest grant
- 15 Jul 2025
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 2018 | 1 | 2 |
| 2019 | 1 | 1 |
| 2020 | 2 | 0 |
| 2021 | 0 | 0 |
| 2022 | 0 | 1 |
| 2023 | 0 | 0 |
| 2024 | 0 | 1 |
| 2025 | 1 | 2 |
By publication year.
Recent patents
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- Multi-layer sheet for mold underfill encapsulation, method for mold underfill encapsulation, electronic component mounting substrate, and production method for electronic component29 Sep 2022US 2022/0310546 A1Nagase Chemtex Corporation
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Most cited
By later US patents