Semiconductor devices including rounded components and related manufacturing methods
AssigneeInfineon Technologies AG
InventorsRainer Markus SCHALLER, Volker STRUTZ, Chin Yong NEO, Chan Whai KAN, Shao Ping WAN
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Abstract
A semiconductor device includes an electrically conductive carrier and a semiconductor chip arranged over a first portion of the carrier. The semiconductor device further includes a dielectric material arranged between the first portion of the carrier and the semiconductor chip, wherein the dielectric material galvanically isolates the first portion of the carrier and the semiconductor chip. At least one of the first portion of the carrier or the semiconductor chip includes at least one of a rounded corner or a rounded edge.
Claims20
A semiconductor device, comprising:
- an electrically conductive carrier;
- a semiconductor chip arranged over a first portion of the electrically conductive carrier;
- and
- a dielectric material arranged between the first portion of the electrically conductive carrier and the semiconductor chip,
- wherein the dielectric material galvanically isolates the first portion of the electrically conductive carrier and the semiconductor chip, and
- wherein at least one of the first portion of the electrically conductive carrier or the semiconductor chip includes at least one of a rounded corner or a rounded edge.
A method for manufacturing a semiconductor device, the method comprising:
- forming at least one of a rounded corner or a rounded edge of at least one of a first portion of an electrically conductive carrier or a semiconductor chip;
- arranging a dielectric material over the first portion of the electrically conductive carrier;
- and
- arranging the semiconductor chip over the dielectric material, wherein the dielectric material galvanically isolates the first portion of the electrically conductive carrier and the semiconductor chip.
Dependencies are inferred from the claim text.