H10W 72/334
Cross-sectional shape, i.e. in side view
Official title: {Cross-sectional shape, i.e. in side view}
H10W72/334 (Cross-sectional shape, i.e. in side view) appears on 1,067 US grants and 1,263 published applications in this corpus.
Search patents in H10W- Granted patents
- 1,067
- Published applications
- 1,263
- Assignees
- 365
- Inventors
- 2,515
- Latest grant
- 6 Oct 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1983 | 1 | 0 |
| 1984 | 1 | 0 |
| 1985 | 2 | 0 |
| 1986 | 2 | 0 |
| 1987 | 0 | 0 |
| 1988 | 0 | 0 |
| 1989 | 1 | 0 |
| 1990 | 3 | 0 |
| 1991 | 1 | 0 |
| 1992 | 5 | 0 |
| 1993 | 3 | 0 |
| 1994 | 3 | 0 |
| 1995 | 2 | 0 |
| 1996 | 6 | 0 |
| 1997 | 6 | 0 |
| 1998 | 13 | 0 |
| 1999 | 8 | 0 |
| 2000 | 17 | 0 |
| 2001 | 24 | 10 |
| 2002 | 25 | 31 |
| 2003 | 16 | 18 |
| 2004 | 24 | 29 |
| 2005 | 17 | 13 |
| 2006 | 24 | 31 |
| 2007 | 23 | 43 |
| 2008 | 18 | 27 |
| 2009 | 12 | 36 |
| 2010 | 39 | 41 |
| 2011 | 26 | 43 |
| 2012 | 27 | 42 |
| 2013 | 52 | 23 |
| 2014 | 46 | 48 |
| 2015 | 36 | 42 |
| 2016 | 28 | 47 |
| 2017 | 49 | 44 |
| 2018 | 32 | 48 |
| 2019 | 44 | 52 |
| 2020 | 54 | 97 |
| 2021 | 56 | 96 |
| 2022 | 59 | 100 |
| 2023 | 81 | 81 |
| 2024 | 72 | 76 |
| 2025 | 58 | 88 |
| 2026 | 51 | 57 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
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- Anchor-containing underfill structures for a chip package and methods of forming the same29 Sep 2026US 12,751,304 B2Taiwan Semiconductor Manufacturing Company.Ltd
- Display apparatus29 Sep 2026US 12,751,319 B2LG Display Co., Ltd.
- Electronic devices and methods of manufacturing electronic devices22 Sep 2026US 12,745,629 B2Amkor Technology Singapore Holding Pte.Ltd.
- Semiconductor package with reduced adhesive fillets22 Sep 2026US 12,745,680 B2Samsung Electronics Co., Ltd.
- Semiconductor structure and methods of manufacturing the same1 Oct 2026US 2026/0305394 A1Taiwan Semiconductor Manufacturing Company.Ltd
- Die attachment film, dicing die bonding film, and semiconductor device manufacturing method1 Oct 2026US 2026/0305443 A1Resonac Corporation
- Semiconductor package1 Oct 2026US 2026/0305477 A1Samsung Electronics Co., Ltd.
- Semiconductor device and manufacturing method for semiconductor device24 Sep 2026US 2026/0293739 A1Kioxia Corporation
- Method of fabricating semiconductor package17 Sep 2026US 2026/0282924 A1Samsung Electronics Co., Ltd.
Most cited
By later US patents
- Fabrication process of semiconductor package and semiconductor package390US 5,976,912 AHitachi Chemical Company, Ltd. · 1999
- Pad array semiconductor device264US 5,592,025 AMotorola, Inc. · 1997
- Resin-sealed semiconductor device, circuit member used therefor245US 6,201,292 B1Dai Nippon Insatsu Kabushiki Kaisha · 2001
- Method and structure for wafer to wafer bonding in semiconductor packaging237US 8,377,798 B2Taiwan Semiconductor Manufacturing Company.Ltd · 2013
- Resin-sealed semiconductor device, circuit member for use therein and method of manufacturing resin-sealed semiconductor device228US 6,025,640 ADai Nippon Insatsu Kabushiki Kaisha · 2000