Method of fabricating semiconductor package

A method of fabricating a semiconductor package, comprising:

• providing a semiconductor substrate comprising a substrate pad;
• providing a first semiconductor chip comprising a first chip pad;
• bringing the first semiconductor chip in to contact with the semiconductor substrate such that the first chip pad is vertically aligned to the substrate pad;
• performing a first thermal treatment process on the semiconductor substrate and the first semiconductor chip to bond the first semiconductor chip to the semiconductor substrate;
• providing a second semiconductor chip comprising a second chip pad;
• providing a third semiconductor chip comprising a third chip pad;
• bringing the third semiconductor chip into contact with the second semiconductor chip such that the second chip pad is vertically aligned to the third chip pad;
• bonding the third semiconductor chip to the second semiconductor chip by performing a second thermal treatment process on the second semiconductor chip and the third semiconductor chip to form a first chip structure;
• and
• mounting the first chip structure on the first semiconductor chip using first connection terminals, the first connection terminals connect the second semiconductor chip of the first chip structure and the first semiconductor chip,
• wherein the substrate pad and the first chip pad each comprise a same metallic material and form a first single structure or layer by the first thermal treatment process, and
• wherein the second chip pad and the third chip pad form a second single structure or layer, which is formed of the same metallic material as the substrate pad, by the second thermal treatment process.