Method and structure for wafer to wafer bonding in semiconductor packaging
AssigneeTaiwan Semiconductor Manufacturing Company, Ltd.
InventorsJung-Huei Peng, Hsin-Ting Huang, Yao-Te Huang, Shang-Ying Tsai, Ping-Yin Liu
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Abstract
A method for wafer to wafer bonding in semiconductor packaging provides for roughening the bonding surfaces in one embodiment. Also provided is a method for passivating the bonding surfaces with a lower melting point material that becomes forced away from the bonding interface during bonding. Also provided is a method for forming an eutectic at the bonding interface to reduce the impact of any native oxide formation at the bonding interface.
Claims23
A method for bonding substrates to one another, comprising:
- providing a duality of substrates, each said substrate including a bonding surface;
- depositing a layer of bonding material on each said bonding surface, each said layer of bonding material including an upper surface;
- roughening at least one said upper surface to produce a roughened uppermost, exposed surface;
- orienting said substrates such that said bonding surfaces, including said at least one roughened uppermost, exposed surface, face each other;
- and
- without covering either of said upper surfaces, bonding said substrates together by urging said respective bonding surfaces, including said uppermost, exposed surface, directly together such that said respective bonding surfaces, including said uppermost, exposed surface, directly contact one another.
A method for bonding substrates to one another, comprising:
- providing a duality of substrates, each said substrate including a bonding surface;
- depositing a layer of bonding material on each said bonding surface, each said layer of bonding material including an upper surface;
- performing an oxide removal operation capable of removing oxide from said upper surfaces of said layers of bonding material;
- depositing passivating material on at least one said layer of bonding material, said passivating material having a lower melting point than said corresponding bonding material and said layer of corresponding bonding material and said passivating material combining to form a composite film structure;
- patterning said composite film structure to produce patterned segments;
- and
- bonding by heating and urging corresponding patterned segments of said substrates against each other by applying pressure, thereby forcing melting and lateral extrusion of said passivating material and substantially causing contact between said upper surfaces of said layers of bonding material of said respective substrates.
A method for bonding substrates to one another, comprising:
- providing a first substrate and a second substrate, each said substrate including a bonding surface;
- depositing a first bonding material on said bonding surface of said first substrate;
- depositing a second bonding material on said bonding surface of said second substrate;
- depositing a layer of said second bonding material on said first bonding material on said first substrate, thereby forming a first film stack and a first eutectic;
- depositing a layer of said first bonding material on said second bonding material on said second substrate, thereby forming a second film stack and a second eutectic;
- and
- bonding said first substrate to said second substrate.
A method for bonding substrates to one another, comprising:
- providing a duality of substrates, each said substrate including a bonding surface;
- depositing a layer of bonding material on each said bonding surface;
- each said layer of bonding material including an upper surface;
- causing the formation of an uppermost, exposed surface with prominent apices on at least a first upper surface of said duality of upper surfaces by at least roughening at least said first upper surface;
- orienting said substrates such that said bonding surfaces, including said at least one uppermost, exposed surface, face each other;
- and
- without covering either of said upper surfaces, bonding said substrates together by urging said bonding surfaces, including said at least one uppermost, exposed surface, into direct contact with one another.
Dependencies are inferred from the claim text.