Fabrication process of semiconductor package and semiconductor package

A process for the fabrication of semiconductor packages, which comprises the following steps:

• A) forming plural sets of wiring on one side of an insulating supporting member;
• B) removing said insulating supporting member at positions where external connection terminals for said wiring are to be formed, whereby through-holes for said external connection terminals are provided;
• C) mounting semiconductor devices on said insulating supporting member on which said plural sets of wiring have been formed, and then electrically connecting terminals of said semiconductor devices with said wiring, respectively;
• D) sealing said semiconductor devices with resin;
• E) forming, in said through-holes for said external connection terminals, said external connection terminals so that said external connection terminals are electrically connected to said wiring;
• and
• F) separating the resultant assembly into individual semiconductor packages,
• wherein
• each of said sets of wiring comprises more than one wiring having an inner connection section to be connected to a terminal of the semiconductor device and a mounting region on which the semiconductor device is to be mounted;
• and
• said step C is a step in which the semiconductor device is mounted on said mounting region of said wiring and said terminal of the semiconductor device is connected with said inner connection section.