H10W 72/332
Plan-view shape, i.e. in top view
Official title: {Plan-view shape, i.e. in top view}
H10W72/332 (Plan-view shape, i.e. in top view) appears on 422 US grants and 548 published applications in this corpus.
Search patents in H10W- Granted patents
- 422
- Published applications
- 548
- Assignees
- 223
- Inventors
- 1,109
- Latest grant
- 6 Oct 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1987 | 1 | 0 |
| 1988 | 0 | 0 |
| 1989 | 0 | 0 |
| 1990 | 0 | 0 |
| 1991 | 0 | 0 |
| 1992 | 0 | 0 |
| 1993 | 0 | 0 |
| 1994 | 0 | 0 |
| 1995 | 2 | 0 |
| 1996 | 0 | 0 |
| 1997 | 2 | 0 |
| 1998 | 0 | 0 |
| 1999 | 2 | 0 |
| 2000 | 1 | 0 |
| 2001 | 6 | 4 |
| 2002 | 2 | 10 |
| 2003 | 7 | 10 |
| 2004 | 11 | 11 |
| 2005 | 8 | 11 |
| 2006 | 2 | 8 |
| 2007 | 7 | 13 |
| 2008 | 6 | 15 |
| 2009 | 5 | 6 |
| 2010 | 13 | 16 |
| 2011 | 15 | 21 |
| 2012 | 14 | 34 |
| 2013 | 22 | 18 |
| 2014 | 22 | 23 |
| 2015 | 24 | 48 |
| 2016 | 29 | 29 |
| 2017 | 32 | 26 |
| 2018 | 26 | 19 |
| 2019 | 24 | 29 |
| 2020 | 16 | 30 |
| 2021 | 14 | 25 |
| 2022 | 26 | 36 |
| 2023 | 16 | 26 |
| 2024 | 30 | 47 |
| 2025 | 21 | 21 |
| 2026 | 16 | 12 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
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- Package structure and method for fabricating the same1 Sep 2026US 12,727,477 B2Wistron Neweb Corp.
- Via array in a redistribution layer structure for stress relief18 Aug 2026US 12,713,947 B2Taiwan Semiconductor Manufacturing Company.Ltd
- Semiconductor package and manufacturing method therefor11 Aug 2026US 12,708,031 B2LG Innotek Co., Ltd.
- Package with thermal conductive material interspersed in depopulated regions of solder bumps7 Jul 2026US 12,677,658 B2GLOBALFOUNDRIES U. S. Inc.
- Semiconductor device and manufacturing method therefor17 Sep 2026US 2026/0282945 A1Kabushiki Kaisha Toshiba
- Semiconductor package17 Sep 2026US 2026/0282983 A1Samsung Electronics Co., Ltd.
- Method and lead frame with die attach film23 Jul 2026US 2026/0215291 A1
- Method of manufacturing semiconductor devices and corresponding semiconductor device2 Jul 2026US 2026/0191002 A1STMicroelectronics International N. V.
- Electronic device and method for manufacturing electronic device2 Jul 2026US 2026/0191031 A1Rohm Co., Ltd.
Most cited
By later US patents
- Leadframe for use in manufacturing a resin-molded semiconductor device295US 6,208,020 B1Matsushita Electronics Corporation · 2001
- Plastic molded type semiconductor device and fabrication process thereof194US 6,291,273 B1Hitachi, Ltd. · 2001
- Method of forming light emitting devices including forming mesas and singulating178US 7,208,337 B2OSRAM Opto Semiconductors GmbH · 2007
- Semiconductor flipchip packaging having a perimeter wall110US 5,448,114 AKabushiki Kaisha Toshiba · 1995
- Semiconductor device78US 6,774,466 B1Hitachi Tohbu Semiconductor, Ltd. · 2004